Presentation 2014-10-24
Development of High-sensitivity HTS Receiver Module with Hermetic Thermal Insulation Waveguide
Tamio KAWAGUCHI, Noritsugu SHIOKAWA, Kohei NAKAYAMA, Mutsuki YAMAZAKI, Hiroaki IKEUCHI, Hiroyuki KAYANO,
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Abstract(in English) We have proposed a high-sensitivity high-Tc superconducting (HTS) receiver module with hermetic thermal insulation waveguides. The hermetic thermal insulation waveguide consists of two silver-plated aluminum oxide waveguides and copper wall. The waveguide with a gap between the aluminum oxide waveguides realizes thermal insulation between room temperature and low temperature. And the hermetic waveguide is connected to a vacuum flange to seal the vacuum chamber. This waveguide operates in the 3 GHz band and the dimension of this waveguide is 6.9 x 26.1 mm, one-third of the size of a conventional hollow metallic waveguide. The waveguide realizes an insertion loss of 0.4 dB and thermal conductivity 1/10 that of 2.2φ semi-rigid coaxial copper cable. The HTS receiver module is composed of the developed waveguides, an HTS filter, a cryogenic low-noise amplifier (LNA), and a limiter. The HTS receiver module realized low thermal noise of 60 K.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Aluminum oxide dielectric rectangular column / Rectangular waveguide / Thermal insulation / HTS receiver module / Low-noise amplifier
Paper # EMCJ2014-64,MW2014-120,EST2014-78
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Committee MW
Conference Date 2014/10/16(1days)
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Registration To Microwaves (MW)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Development of High-sensitivity HTS Receiver Module with Hermetic Thermal Insulation Waveguide
Sub Title (in English)
Keyword(1) Aluminum oxide dielectric rectangular column
Keyword(2) Rectangular waveguide
Keyword(3) Thermal insulation
Keyword(4) HTS receiver module
Keyword(5) Low-noise amplifier
1st Author's Name Tamio KAWAGUCHI
1st Author's Affiliation Corporate Research and Development Center, Toshiba Corporation()
2nd Author's Name Noritsugu SHIOKAWA
2nd Author's Affiliation Corporate Research and Development Center, Toshiba Corporation
3rd Author's Name Kohei NAKAYAMA
3rd Author's Affiliation Corporate Research and Development Center, Toshiba Corporation
4th Author's Name Mutsuki YAMAZAKI
4th Author's Affiliation Corporate Research and Development Center, Toshiba Corporation
5th Author's Name Hiroaki IKEUCHI
5th Author's Affiliation Corporate Research and Development Center, Toshiba Corporation
6th Author's Name Hiroyuki KAYANO
6th Author's Affiliation Corporate Research and Development Center, Toshiba Corporation
Date 2014-10-24
Paper # EMCJ2014-64,MW2014-120,EST2014-78
Volume (vol) vol.114
Number (no) 267
Page pp.pp.-
#Pages 6
Date of Issue