Presentation 2014-10-23
Basic Study of Transmission of Microstrip Line Placed on Ground Slot
Kunihiro TAKAMATSU, Teruo TOBANA, Takayuki SASAMORI, Yoji ISOTA,
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Abstract(in English) Recently, slots are formed in ground planes placed on a printed circuit board since circuits become high-density. The properties of a line closed a slots are influenced by it. The effects of slots are issues for circuit designs in future. There is Multi-Transmission Line Method calculated in a short time. It is important to consider the effects of slots in the MTL method. In this paper, we analyzed properties of microstrip line with the slot under that placed on a printed circuit board using MTL method and FDTD method and compared with these results. We showed that these results are different greatly as the width of a slot and the frequency increases by varying the width and the length of the slot.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) ground slot / multi-transmission line method / microstrip line
Paper # EMCJ2014-44,MW2014-100,EST2014-58
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Committee EST
Conference Date 2014/10/16(1days)
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Registration To Electronic Simulation Technology (EST)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Basic Study of Transmission of Microstrip Line Placed on Ground Slot
Sub Title (in English)
Keyword(1) ground slot
Keyword(2) multi-transmission line method
Keyword(3) microstrip line
1st Author's Name Kunihiro TAKAMATSU
1st Author's Affiliation Faculty of System Science and Technology, Akita Prefectural University()
2nd Author's Name Teruo TOBANA
2nd Author's Affiliation Faculty of System Science and Technology, Akita Prefectural University
3rd Author's Name Takayuki SASAMORI
3rd Author's Affiliation Faculty of System Science and Technology, Akita Prefectural University
4th Author's Name Yoji ISOTA
4th Author's Affiliation Faculty of System Science and Technology, Akita Prefectural University
Date 2014-10-23
Paper # EMCJ2014-44,MW2014-100,EST2014-58
Volume (vol) vol.114
Number (no) 268
Page pp.pp.-
#Pages 6
Date of Issue