Presentation 2014-10-24
Effect of Post-Deposition Annealing in Hydrogen Atmosphere on 4H-SiCMIS Property Prepared by Thermal CVD Method Using Tetraethylorthosilicate
Takuo KANOU, Yoshiyuki AKAHANE, Yuta KOBAYASHI, Tomohiko YAMAKAMI, Kiichi KAMIMURA,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Silicon dioxide films were deposited by the thermal decomposition of tetraethylorthosilicate (TEOS) to form the MIS structure, and were annealed in hydrogen ambient to improve the quality of TEOS-SiO_2/SiC MIS interface. The quality of the film was improved by annealing in hydrogen ambient after deposition, and the interface state density was greatly reduced. Defects seemed to be formed at the interface between SiO_2 and SiC during the annealing in N_2 by the reaction of residual TEOS molecules in the SiO_2 film with the SiC surface. The interface property was improved by the annealing in Hi. This may be because no oxidation occurred and defects were terminated by H atoms during annealing in H_2.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) TEOS / SiC / MOS / CVD / annealing
Paper # CPM2014-109
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Conference Information
Committee CPM
Conference Date 2014/10/17(1days)
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Paper Information
Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Effect of Post-Deposition Annealing in Hydrogen Atmosphere on 4H-SiCMIS Property Prepared by Thermal CVD Method Using Tetraethylorthosilicate
Sub Title (in English)
Keyword(1) TEOS
Keyword(2) SiC
Keyword(3) MOS
Keyword(4) CVD
Keyword(5) annealing
1st Author's Name Takuo KANOU
1st Author's Affiliation Department of Electrical and Electronic Engineering, Shinshu University()
2nd Author's Name Yoshiyuki AKAHANE
2nd Author's Affiliation Department of Electrical and Electronic Engineering, Shinshu University
3rd Author's Name Yuta KOBAYASHI
3rd Author's Affiliation Department of Electrical and Electronic Engineering, Shinshu University
4th Author's Name Tomohiko YAMAKAMI
4th Author's Affiliation Department of Electrical and Electronic Engineering, Shinshu University
5th Author's Name Kiichi KAMIMURA
5th Author's Affiliation Department of Electrical and Electronic Engineering, Shinshu University
Date 2014-10-24
Paper # CPM2014-109
Volume (vol) vol.114
Number (no) 276
Page pp.pp.-
#Pages 4
Date of Issue