Presentation 2014-07-09
A Note on the 3-D IC TSV Assignment Problem
Satoshi TAYU, Toshiyuki HONGO, Shuichi UENO,
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Abstract(in English) The three dimensional (3-D) integrated circuit (IC) through-silicon via (TSV) assignment problem is to assign TSVs for 3-D nets so that the 3-D nets are routed with minimum total cost. It has been known that the problem is NP-hard for the general cost. This paper shows that the problem is NP-hard even if the cost is more practical such as the estimated routing wirelength.
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Keyword(in English) 3-D IC / NP-complete / through-silicon via (TSV) / TSV assignment
Paper # CAS2014-11,VLD2014-20,SIP2014-32,MSS2014-11,SIS2014-11
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Conference Date 2014/7/2(1days)
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Language ENG
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A Note on the 3-D IC TSV Assignment Problem
Sub Title (in English)
Keyword(1) 3-D IC
Keyword(2) NP-complete
Keyword(3) through-silicon via (TSV)
Keyword(4) TSV assignment
1st Author's Name Satoshi TAYU
1st Author's Affiliation Department of Communications and Computer Engeneering Tokyo Institute of Technology()
2nd Author's Name Toshiyuki HONGO
2nd Author's Affiliation Department of Communications and Computer Engeneering Tokyo Institute of Technology
3rd Author's Name Shuichi UENO
3rd Author's Affiliation Department of Communications and Computer Engeneering Tokyo Institute of Technology
Date 2014-07-09
Paper # CAS2014-11,VLD2014-20,SIP2014-32,MSS2014-11,SIS2014-11
Volume (vol) vol.114
Number (no) 125
Page pp.pp.-
#Pages 6
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