Presentation	2014-06-20 Improvement of Electrical Properties of n-ZnO/p-CuO Heterojunctions Prepared by Chemical Bath Deposition : Insertion of Intermediate Layer and Thermal Annealing Tomoaki TERASAKO, Toshihiro MURAKAMI, Atsushi HYOUDOU, Sho SHIRAKATA,
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Abstract(in English)	Electrical properties of n-ZnO/p-CuO heterojunctions prepared by chemical bath deposition were investigated. The insertion of intermediate layer, such as ZnO layer grown by dip-coating, was found to be effective for suppressing leakage current. For the ZnO/Dip-coating ZnO/CuO heterojunctions, the threshold voltage V_	and ideality factor n of the J-V curve and the built-in potential V_ determined from the C-V curve had minima around the post-annealing temperature for CuO layer (T_A) of 250℃. Relatively low I_F/I_R values (I_F: forward current, I_R: reverse current) at T_As higher than T_A=225℃ suggest the contribution of the tunnel current through the defect states to the reduction of the V_	and V_.
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Keyword(in English)	Chemical bath deposition / ZnO / CuO / pn heterojunction
Paper #	EMD2014-19,CPM2014-39,OME2014-27
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Conference Information
Committee	EMD
Conference Date	2014/6/13(1days)
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Paper Information
Registration To	Electromechanical Devices (EMD)
Language	JPN
Title (in Japanese)	(See Japanese page)
Sub Title (in Japanese)	(See Japanese page)
Title (in English)	Improvement of Electrical Properties of n-ZnO/p-CuO Heterojunctions Prepared by Chemical Bath Deposition : Insertion of Intermediate Layer and Thermal Annealing
Sub Title (in English)
Keyword(1)	Chemical bath deposition
Keyword(2)	ZnO
Keyword(3)	CuO
Keyword(4)	pn heterojunction
1st Author's Name	Tomoaki TERASAKO
1st Author's Affiliation	Graduate School of Science and Engineering, Ehime University()
2nd Author's Name	Toshihiro MURAKAMI
2nd Author's Affiliation	Graduate School of Science and Engineering, Ehime University
3rd Author's Name	Atsushi HYOUDOU
3rd Author's Affiliation	Faculty of Engineering, Ehime University
4th Author's Name	Sho SHIRAKATA
4th Author's Affiliation	Graduate School of Science and Engineering, Ehime University
Date	2014-06-20
Paper #	EMD2014-19,CPM2014-39,OME2014-27
Volume (vol)	vol.114
Number (no)	94
Page	pp.pp.-
#Pages	6
Date of Issue