Presentation 2013-12-20
Optical packaging of silicon photonic devices : External Connection of Parallel Optical Signals
Yoichi TAIRA, Hidetoshi NUMATA,
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Abstract(in English) Optical packaging method is necessary for silicon nanophotinic devices. We evaluate various optical connection methods for the silicon photonic transceivers, in terms of connection of waveguides on silicon chips to the external optical cables. An intermediate optical path such as optical waveguides or optical fibers is beneficial to couple the on-silicon optical signals with external fibers for high bandwidth transceiver devices. For the CPU like modules with large bandwidth optical input and output, various requirements such as for electrical and optical connection, accurate module positioning, and cleanliness of the optical interface have to be considered. The dual lens coupling scheme is effective in relaxing these requirements.
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Keyword(in English) Silicon photonics / Optical packaging / Optical connector / Microlens
Paper # OPE2013-138
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Committee OPE
Conference Date 2013/12/13(1days)
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Registration To Optoelectronics (OPE)
Language JPN
Title (in Japanese) (See Japanese page)
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Title (in English) Optical packaging of silicon photonic devices : External Connection of Parallel Optical Signals
Sub Title (in English)
Keyword(1) Silicon photonics
Keyword(2) Optical packaging
Keyword(3) Optical connector
Keyword(4) Microlens
1st Author's Name Yoichi TAIRA
1st Author's Affiliation IBM Research-Tokyo()
2nd Author's Name Hidetoshi NUMATA
2nd Author's Affiliation IBM Research-Tokyo
Date 2013-12-20
Paper # OPE2013-138
Volume (vol) vol.113
Number (no) 370
Page pp.pp.-
#Pages 6
Date of Issue