Presentation | 2013-12-20 Optical packaging of silicon photonic devices : External Connection of Parallel Optical Signals Yoichi TAIRA, Hidetoshi NUMATA, |
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Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | Optical packaging method is necessary for silicon nanophotinic devices. We evaluate various optical connection methods for the silicon photonic transceivers, in terms of connection of waveguides on silicon chips to the external optical cables. An intermediate optical path such as optical waveguides or optical fibers is beneficial to couple the on-silicon optical signals with external fibers for high bandwidth transceiver devices. For the CPU like modules with large bandwidth optical input and output, various requirements such as for electrical and optical connection, accurate module positioning, and cleanliness of the optical interface have to be considered. The dual lens coupling scheme is effective in relaxing these requirements. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | Silicon photonics / Optical packaging / Optical connector / Microlens |
Paper # | OPE2013-138 |
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Committee | OPE |
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Conference Date | 2013/12/13(1days) |
Place (in Japanese) | (See Japanese page) |
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Registration To | Optoelectronics (OPE) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Optical packaging of silicon photonic devices : External Connection of Parallel Optical Signals |
Sub Title (in English) | |
Keyword(1) | Silicon photonics |
Keyword(2) | Optical packaging |
Keyword(3) | Optical connector |
Keyword(4) | Microlens |
1st Author's Name | Yoichi TAIRA |
1st Author's Affiliation | IBM Research-Tokyo() |
2nd Author's Name | Hidetoshi NUMATA |
2nd Author's Affiliation | IBM Research-Tokyo |
Date | 2013-12-20 |
Paper # | OPE2013-138 |
Volume (vol) | vol.113 |
Number (no) | 370 |
Page | pp.pp.- |
#Pages | 6 |
Date of Issue |