| Presentation | 2014-05-23 A study on image processing of the object detection using frequency domain correlation in radiographic inspection equipment Yoichi KATO, Motoaki Mouri, Hiroshi YASUKAWA, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | X-ray inspection equipment is often used by the inspection of PCB required high quality. Especially BGA solder-bumps sealed by the LSI package resin are mainly inspected by X-ray. In recent years, miniaturization of the solder-bumps and multi-layering of LSI structure make X-ray inspection indispensable because of the improved quality of industrial products, and improvement in image quality is required much more. Although the conventional technique of the noise suppressed on an inspection image is an addition average processing, the increase in X-ray inspection time is influenced critically. So, in the main subject, the image processing technology which reduces the frame number for addition average processing rather than the conventional technique is proposed. At first, a reference image of the integrous BGA solder-bumps is prepared in order to improve quality of an inspection image. Second, in a low-frequency region, αblend is performed with the correlation coefficient between the power spectrum of an inspection and a reference image. Finally, image quality is improved in real space, and the validity which can reduce the frame number by the proposed technique less than the conventional is examined. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | BGA solder-bump / Inspection image / Reference image / Correlation coefficient / αBlend |
| Paper # | SIP2014-19,IE2014-19,PRMU2014-19,MI2014-19 |
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| Conference Information | |
| Committee | IE |
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| Conference Date | 2014/5/15(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
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| Paper Information | |
| Registration To | Image Engineering (IE) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | A study on image processing of the object detection using frequency domain correlation in radiographic inspection equipment |
| Sub Title (in English) | |
| Keyword(1) | BGA solder-bump |
| Keyword(2) | Inspection image |
| Keyword(3) | Reference image |
| Keyword(4) | Correlation coefficient |
| Keyword(5) | αBlend |
| 1st Author's Name | Yoichi KATO |
| 1st Author's Affiliation | Graduate School of Information Science and Technology, Aichi Prefectural University() |
| 2nd Author's Name | Motoaki Mouri |
| 2nd Author's Affiliation | Faculty of Business Administration, Aichi University |
| 3rd Author's Name | Hiroshi YASUKAWA |
| 3rd Author's Affiliation | Faculty of Business Administration, Aichi University |
| Date | 2014-05-23 |
| Paper # | SIP2014-19,IE2014-19,PRMU2014-19,MI2014-19 |
| Volume (vol) | vol.114 |
| Number (no) | 40 |
| Page | pp.pp.- |
| #Pages | 7 |
| Date of Issue | |