Presentation 2013/12/9
A 60GHz CMOS Frontend Wireless Module with an Antenna using 3-Layered Structure
Suguru FUJITA, Maki NAKAMURA, Takayuki TSUKIZAWA, Koji TAKINAMI,
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Abstract(in English) In order to mount a short range wireless communication system in consumer electronics products, the authors have been researching on a 60GHz radio module and reported a cavity structure module that integrates a 60GHz CMOS front-end IC as well as antennas in a small form factor. In this report, we propose a three-layer structure wireless module that is suitable for high pin count can be more compact as compared to the conventional cavity structure. We analyze 60GHz connection method between the IC and the antenna which is the key to realize the proposed module. The fabricated prototype achieves only 1.2dB connection loss while integrating antennas and the 60GHz CMOS front-end IC based on WiGig/IEEE802.11ad including SMT components.
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Keyword(in English) Millimeter-wave / Wireless module / Metal ball
Paper # SRWl2013-39
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Committee SRW
Conference Date 2013/12/9(1days)
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Registration To Short Range Wireless Communications(SRW)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A 60GHz CMOS Frontend Wireless Module with an Antenna using 3-Layered Structure
Sub Title (in English)
Keyword(1) Millimeter-wave
Keyword(2) Wireless module
Keyword(3) Metal ball
1st Author's Name Suguru FUJITA
1st Author's Affiliation R&D Division, Panasonic Corporation()
2nd Author's Name Maki NAKAMURA
2nd Author's Affiliation R&D Division, Panasonic Corporation
3rd Author's Name Takayuki TSUKIZAWA
3rd Author's Affiliation R&D Division, Panasonic Corporation
4th Author's Name Koji TAKINAMI
4th Author's Affiliation R&D Division, Panasonic Corporation
Date 2013/12/9
Paper # SRWl2013-39
Volume (vol) vol.113
Number (no) 356
Page pp.pp.-
#Pages 6
Date of Issue