Presentation 2013-12-13
Construction of High Quality Delay Test Set Using Fast On-Chip Delay Measurement
Kentaroh KATOH, Haruo KOBAYASHI,
PDF Download Page PDF download Page Link
Abstract(in Japanese) (See Japanese page)
Abstract(in English) Today, low power and high speed LSIs such as microprocessors and SoCs are indispensable in various consumer devices and information infrastructures. To meet the needs of the market, further scaling of devices is required. However scaling of devices induces the frequency of the frequency of the timing related errors. In this study, we present a high quality delay test set using fast on-chip delay measurement. This technique is composed of two phases. In the first phase, critical path analysis is performed using on-chip delay measurement with TDC. In the second phase, test set is created with the analysis of critical paths of the first phase. Experimental result shows that the data overhead of the test vector is 13% on average.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Delay Measurement / TDC / LOS / Static Merge
Paper # DC2013-70
Date of Issue

Conference Information
Committee DC
Conference Date 2013/12/6(1days)
Place (in Japanese) (See Japanese page)
Place (in English)
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair
Vice Chair
Secretary
Assistant

Paper Information
Registration To Dependable Computing (DC)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Construction of High Quality Delay Test Set Using Fast On-Chip Delay Measurement
Sub Title (in English)
Keyword(1) Delay Measurement
Keyword(2) TDC
Keyword(3) LOS
Keyword(4) Static Merge
1st Author's Name Kentaroh KATOH
1st Author's Affiliation Dept. of Electrical Engineering, Tsuruoka National College of Technology()
2nd Author's Name Haruo KOBAYASHI
2nd Author's Affiliation Faculty of Science and Technology, Gunma University
Date 2013-12-13
Paper # DC2013-70
Volume (vol) vol.113
Number (no) 353
Page pp.pp.-
#Pages 4
Date of Issue