Presentation 2014-01-29
Heated Ion Implantation Technology for Highly Reliable Metal-gate/High-k CMOS SOI FinFETs
Wataru MIZUBAYASHI, Hiroshi ONODA, Yoshiki NAKASHIMA, Yuki ISHIKAWA, Takashi MATSUKAWA, Kazuhiko ENDO, Yongxun LIU, Shinichi O'UCHI, Junichi TSUKADA, Hiromi YAMAUCHI, Shinji MIGITA, Yukinori MORITA, Hiroyuki OTA, Meishoku MASAHARA,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) The impact of heated ion implantation (I/I) technology on metal-gate (MG)/high-k (HK) CMOS SOI FinFET performance and reliability has been thoroughly investigated. It was demonstrated that heated I/I brings perfect crystallization after annealing even in ultrathin Si channel. For the first time, it was found that heated I/I dramatically improves the characteristics such as I_-I_, V_ variability, and bias temperature instability (BTI) for both nMOS and pMOS FinFETs in comparison with conventional room temperature I/I.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) FinFETs / Source/drain Extension / Heated Ion Implantation / Crystallization / I_ / I_ / BTI Characteristics
Paper # SDM2013-138
Date of Issue

Conference Information
Committee SDM
Conference Date 2014/1/22(1days)
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Paper Information
Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Heated Ion Implantation Technology for Highly Reliable Metal-gate/High-k CMOS SOI FinFETs
Sub Title (in English)
Keyword(1) FinFETs
Keyword(2) Source/drain Extension
Keyword(3) Heated Ion Implantation
Keyword(4) Crystallization
Keyword(5) I_
Keyword(6) I_
Keyword(7) BTI Characteristics
1st Author's Name Wataru MIZUBAYASHI
1st Author's Affiliation Nanoelectronics Research Institute (NeRI), National Institute of Advanced Industrial Science and Technology (AIST)()
2nd Author's Name Hiroshi ONODA
2nd Author's Affiliation Nissin Ion Equipment Co., Ltd.
3rd Author's Name Yoshiki NAKASHIMA
3rd Author's Affiliation Nissin Ion Equipment Co., Ltd.
4th Author's Name Yuki ISHIKAWA
4th Author's Affiliation Nanoelectronics Research Institute (NeRI), National Institute of Advanced Industrial Science and Technology (AIST)
5th Author's Name Takashi MATSUKAWA
5th Author's Affiliation Nanoelectronics Research Institute (NeRI), National Institute of Advanced Industrial Science and Technology (AIST)
6th Author's Name Kazuhiko ENDO
6th Author's Affiliation Nanoelectronics Research Institute (NeRI), National Institute of Advanced Industrial Science and Technology (AIST)
7th Author's Name Yongxun LIU
7th Author's Affiliation Nanoelectronics Research Institute (NeRI), National Institute of Advanced Industrial Science and Technology (AIST)
8th Author's Name Shinichi O'UCHI
8th Author's Affiliation Nanoelectronics Research Institute (NeRI), National Institute of Advanced Industrial Science and Technology (AIST)
9th Author's Name Junichi TSUKADA
9th Author's Affiliation Nanoelectronics Research Institute (NeRI), National Institute of Advanced Industrial Science and Technology (AIST)
10th Author's Name Hiromi YAMAUCHI
10th Author's Affiliation Nanoelectronics Research Institute (NeRI), National Institute of Advanced Industrial Science and Technology (AIST)
11th Author's Name Shinji MIGITA
11th Author's Affiliation Nanoelectronics Research Institute (NeRI), National Institute of Advanced Industrial Science and Technology (AIST)
12th Author's Name Yukinori MORITA
12th Author's Affiliation Nanoelectronics Research Institute (NeRI), National Institute of Advanced Industrial Science and Technology (AIST)
13th Author's Name Hiroyuki OTA
13th Author's Affiliation Nanoelectronics Research Institute (NeRI), National Institute of Advanced Industrial Science and Technology (AIST)
14th Author's Name Meishoku MASAHARA
14th Author's Affiliation Nanoelectronics Research Institute (NeRI), National Institute of Advanced Industrial Science and Technology (AIST)
Date 2014-01-29
Paper # SDM2013-138
Volume (vol) vol.113
Number (no) 420
Page pp.pp.-
#Pages 4
Date of Issue