| Presentation | 2014-01-30 Optimization of the inter-layer connection structure for the high-speed signal Tsuyoshi KOBAYASHI, Kouji SHIBUYA, Norio TAKEUCHI, Kenji MAEDA, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | For a miniaturization and advanced features of equipment, the high-density and quality PCB design is required. Through hole is used, when changing the wiring layers in the printed circuit board. Usually, through-hole has one or two GND via in the vicinity, to provide the return current path. But, digital transmission speed has accelerate. And, high speed signal contains a higher frequency. By a through hole, there is a possibility that signal energy may be leaked to an inner layer. It is the loss of signal. In this study, we simulated the number and placement of GND vias surrounding the through-hole, the relationship of the amount of loss that leaks in the inner layer. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | PCB design / Through-hole / Signal Integrity |
| Paper # | EMCJ2013-115 |
| Date of Issue |
| Conference Information | |
| Committee | EMCJ |
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| Conference Date | 2014/1/23(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Electromagnetic Compatibility (EMCJ) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Optimization of the inter-layer connection structure for the high-speed signal |
| Sub Title (in English) | |
| Keyword(1) | PCB design |
| Keyword(2) | Through-hole |
| Keyword(3) | Signal Integrity |
| 1st Author's Name | Tsuyoshi KOBAYASHI |
| 1st Author's Affiliation | Mitsubishi Electric Corporation() |
| 2nd Author's Name | Kouji SHIBUYA |
| 2nd Author's Affiliation | Mitsubishi Electric Corporation |
| 3rd Author's Name | Norio TAKEUCHI |
| 3rd Author's Affiliation | Mitsubishi Electric Engineering Corporation |
| 4th Author's Name | Kenji MAEDA |
| 4th Author's Affiliation | Mitsubishi Electric Engineering Corporation |
| Date | 2014-01-30 |
| Paper # | EMCJ2013-115 |
| Volume (vol) | vol.113 |
| Number (no) | 423 |
| Page | pp.pp.- |
| #Pages | 4 |
| Date of Issue | |