Presentation 2013-10-24
Magnetic material and IC chip level EMC
Masahiro YAMAGUCHI, Sho MUROGA, Yasushi ENDO, Makoto NAGATA, Satoshi TANAKA,
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Abstract(in English) A technological challenge of LTE(Long Term Evolution) class RFIC is to solve desensitization of receiver circuit caused by the harmonics of clock signal of RF-digital circuits implemented in the in the same IC chip. This problem turns out to be noticeable as the degital assist technique for Si-CMOS circuit becomes popular. This paper explains a new technology to suppress electric current-driven noise on IC chip by utilizing ferromagnetic resonance losses of magnetic thin film in a popular LTE downlink frequency band of 2GHz range. The in-band spurius level was suppressed by 10dB while keeping the Throughput fraction higher than 95%.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Electromagnetic Noise Suppressor / Ferromagnetic Film / Cellular Phone Handset / RFIC / EMC / Signal Integrity
Paper # EMCJ2013-76,MW2013-116,EST2013-68
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Conference Information
Committee EMCJ
Conference Date 2013/10/17(1days)
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Paper Information
Registration To Electromagnetic Compatibility (EMCJ)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Magnetic material and IC chip level EMC
Sub Title (in English)
Keyword(1) Electromagnetic Noise Suppressor
Keyword(2) Ferromagnetic Film
Keyword(3) Cellular Phone Handset
Keyword(4) RFIC
Keyword(5) EMC
Keyword(6) Signal Integrity
1st Author's Name Masahiro YAMAGUCHI
1st Author's Affiliation Graduate School of Engineering, Tohoku Univeristy:Graduate School of Systme Informatics Kobe University()
2nd Author's Name Sho MUROGA
2nd Author's Affiliation Graduate School of Engineering, Tohoku Univeristy
3rd Author's Name Yasushi ENDO
3rd Author's Affiliation Graduate School of Engineering, Tohoku Univeristy
4th Author's Name Makoto NAGATA
4th Author's Affiliation Graduate School of System Informatics Kobe University
5th Author's Name Satoshi TANAKA
5th Author's Affiliation New Industry Creation Hatchery Center, Tohoku Univeristy
Date 2013-10-24
Paper # EMCJ2013-76,MW2013-116,EST2013-68
Volume (vol) vol.113
Number (no) 259
Page pp.pp.-
#Pages 6
Date of Issue