Presentation 2013-08-29
Low-crosstalk and high-modulation bandwidth operation of flip-chip interconnection EADFB laser array module
Shigeru KANAZAWA, Takeshi FUJISAWA, Kiyoto TAKAHATA, Akira OHKI, Ryuzo IGA, Hiroyuki ISHII,
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Abstract(in English) We developed the first EADFB laser array module with new flip-chip interconnects which provide low crosstalk and high modulation bandwidth. Under four-channel simultaneous operation, the 100GBASE-LR4 mask margin of the flip-chip interconnection module was improved up to 24% compared with that of a wire interconnection module.
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Keyword(in English) 100Gigabit Ethernet / Semiconductor laser / EADFB laser / Flip-chip interconnection
Paper # R2013-34,EMD2013-40,CPM2013-59,OPE2013-63,LQE2013-33
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Conference Information
Committee EMD
Conference Date 2013/8/22(1days)
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Registration To Electromechanical Devices (EMD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Low-crosstalk and high-modulation bandwidth operation of flip-chip interconnection EADFB laser array module
Sub Title (in English)
Keyword(1) 100Gigabit Ethernet
Keyword(2) Semiconductor laser
Keyword(3) EADFB laser
Keyword(4) Flip-chip interconnection
1st Author's Name Shigeru KANAZAWA
1st Author's Affiliation NTT Photonics Laboratories, NTT Corporation()
2nd Author's Name Takeshi FUJISAWA
2nd Author's Affiliation NTT Photonics Laboratories, NTT Corporation
3rd Author's Name Kiyoto TAKAHATA
3rd Author's Affiliation NTT Photonics Laboratories, NTT Corporation
4th Author's Name Akira OHKI
4th Author's Affiliation NTT Photonics Laboratories, NTT Corporation
5th Author's Name Ryuzo IGA
5th Author's Affiliation NTT Photonics Laboratories, NTT Corporation
6th Author's Name Hiroyuki ISHII
6th Author's Affiliation NTT Photonics Laboratories, NTT Corporation
Date 2013-08-29
Paper # R2013-34,EMD2013-40,CPM2013-59,OPE2013-63,LQE2013-33
Volume (vol) vol.113
Number (no) 187
Page pp.pp.-
#Pages 4
Date of Issue