| Presentation | 2013-08-01 3D-architecture technology movements and opportunity of Japan Hiroaki IKEDA, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | This is the overview of the world wide TSV/3D integration technology developments and State of the Art in Japan. Latter half of the paper describes current issues to be resolved and expected breakthrough in Material/Equipment region for TSV/3D technologies. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | 3D integration / TSV / 3D |
| Paper # | SDM2013-69,ICD2013-51 |
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| Conference Information | |
| Committee | ICD |
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| Conference Date | 2013/7/25(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
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| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | 3D-architecture technology movements and opportunity of Japan |
| Sub Title (in English) | |
| Keyword(1) | 3D integration |
| Keyword(2) | TSV |
| Keyword(3) | 3D |
| 1st Author's Name | Hiroaki IKEDA |
| 1st Author's Affiliation | Association of Super-Advanced Electronics Technologies (ASET)() |
| Date | 2013-08-01 |
| Paper # | SDM2013-69,ICD2013-51 |
| Volume (vol) | vol.113 |
| Number (no) | 173 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |