| Presentation | 2013-08-02 Barrier Properties of Nanocrystalline HfN_x Films Applicable to Through Si Via Masaru SATO, Mayumi B TAKEYAMA, Eiji AOYAGI, Atsushi NOYA, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Through silicon via (TSV) technology is important to realize 3D integration by stacking chips or wafers. We propose concept of the diffusion barrier material for Cu as a conducting material filled in a downsized via. We choose HfN_x as a material that will meet the concept and examine properties of the HfN_x film as a barrier in the Cu/HfN_x/SiO_2/Si model system. It is revealed that the HfN_x film consists of an HfN phase in a nanocrystalline texture shows good properties as a barrier for TSV application satisfying the concept proposed, indicating that the concept are also valid for that of TSV technology. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | TSV / 3D integration / barrier material / HfN / nanocrystalline |
| Paper # | CPM2013-51 |
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| Conference Information | |
| Committee | CPM |
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| Conference Date | 2013/7/25(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
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| Paper Information | |
| Registration To | Component Parts and Materials (CPM) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Barrier Properties of Nanocrystalline HfN_x Films Applicable to Through Si Via |
| Sub Title (in English) | |
| Keyword(1) | TSV |
| Keyword(2) | 3D integration |
| Keyword(3) | barrier material |
| Keyword(4) | HfN |
| Keyword(5) | nanocrystalline |
| 1st Author's Name | Masaru SATO |
| 1st Author's Affiliation | Faculty of Engineering, Kitami Institute of Technology() |
| 2nd Author's Name | Mayumi B TAKEYAMA |
| 2nd Author's Affiliation | Faculty of Engineering, Kitami Institute of Technology |
| 3rd Author's Name | Eiji AOYAGI |
| 3rd Author's Affiliation | Institute for Materials Research, Tohoku University |
| 4th Author's Name | Atsushi NOYA |
| 4th Author's Affiliation | Faculty of Engineering, Kitami Institute of Technology |
| Date | 2013-08-02 |
| Paper # | CPM2013-51 |
| Volume (vol) | vol.113 |
| Number (no) | 171 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |