Presentation 2013-06-27
Microwave 3-dimensional Band Pass Filter Featuring a Transmission Line Loop and a Parallel Plate Waveguide Series Stub
Takanari MINAMI, Takashi OHIRA,
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Abstract(in English) This paper presents design and fabrication of microwave 3-dimensional band pass filter featuring a transmission line loop and a parallel plate waveguide series stub. This filter meets requirements: insertion loss 5 dB and reflection loss 10 dB at 2.0 GHz ±50 MHz; attenuation 20 dB at 1.5 GHz ±100 MHz and 2.5 GHz ±100 MHz. We designed a filter featuring a higher-order mode resonator consisting of a transmission line loop and a series stub to meet the requirements by a single section. A series stub, however, is difficult to generally integrate a series stub on a substrate. Therefore, we propose a new filter in 3-dimensional structure. This filter is composed of the parallel plate waveguide series stub made of another FR4 substrate standing perpendicularly to the transmission line loop by microstlip line to integrate on FR4 substrate As a result, the fabricated filter exhibits insertion loss 2.9 dB at worst and reflection loss 12.6 dB at worst, attenuation 28.9 dB at lower side band, 21.2 dB at higher side band.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) band pass filter / series stub / 3-dimensional structure / transmission line / loop
Paper # MW2013-29
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Committee MW
Conference Date 2013/6/20(1days)
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Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Microwave 3-dimensional Band Pass Filter Featuring a Transmission Line Loop and a Parallel Plate Waveguide Series Stub
Sub Title (in English)
Keyword(1) band pass filter
Keyword(2) series stub
Keyword(3) 3-dimensional structure
Keyword(4) transmission line
Keyword(5) loop
1st Author's Name Takanari MINAMI
1st Author's Affiliation Toyohashi University of Technology, Department of Electrical and Electronic Information Engineering()
2nd Author's Name Takashi OHIRA
2nd Author's Affiliation Toyohashi University of Technology, Electrical and Electronic Information Engineering
Date 2013-06-27
Paper # MW2013-29
Volume (vol) vol.113
Number (no) 110
Page pp.pp.-
#Pages 4
Date of Issue