Presentation | 2013-07-11 Impedance Balance Control for Suppression of Substrate Noise Coupling in CMOS IC Masaaki MAEDA, Tohlu MATSUSHIMA, Takashi HISAKADO, Osami WADA, |
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Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | Simultaneous switching current generated by operation of a CMOS circuit is injected into the CMOS substrate, and causes the substrate voltage bounce. The performance of the circuit degrades due to the voltage bounce. In this report, we focus on the fact that parasitic couplings in the CMOS substrate and parasitic inductance in the power and ground connection form a bridge circuit, and we demonstrate that the voltage bounce can be suppressed by controlling variable resistances that are inserted between the substrate resistive coupling and the conductor line for the power supply. The effectiveness of this method is verified with a quad flat package (QFP) and we reduced the voltage bounce about 40 dB. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | CMOS circuit / Substrate noise coupling / Impedance balance control / QFP |
Paper # | EMCJ2013-30 |
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Committee | EMCJ |
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Conference Date | 2013/7/4(1days) |
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Registration To | Electromagnetic Compatibility (EMCJ) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Impedance Balance Control for Suppression of Substrate Noise Coupling in CMOS IC |
Sub Title (in English) | |
Keyword(1) | CMOS circuit |
Keyword(2) | Substrate noise coupling |
Keyword(3) | Impedance balance control |
Keyword(4) | QFP |
1st Author's Name | Masaaki MAEDA |
1st Author's Affiliation | Department of Electrical Engineering, Kyoto University() |
2nd Author's Name | Tohlu MATSUSHIMA |
2nd Author's Affiliation | Department of Electrical Engineering, Kyoto University |
3rd Author's Name | Takashi HISAKADO |
3rd Author's Affiliation | Department of Electrical Engineering, Kyoto University |
4th Author's Name | Osami WADA |
4th Author's Affiliation | Department of Electrical Engineering, Kyoto University |
Date | 2013-07-11 |
Paper # | EMCJ2013-30 |
Volume (vol) | vol.113 |
Number (no) | 122 |
Page | pp.pp.- |
#Pages | 6 |
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