Presentation 2013-07-11
Noise immunity design for multilayer printed circuit boards using fast electromagnetic simulation
Mamoru Kamikura, Yuichiro Murata, Yudai Yoneoka,
PDF Download Page PDF download Page Link
Abstract(in Japanese) (See Japanese page)
Abstract(in English) We report on noise immunity design for multilayer printed circuit boards using fast electromagnetic simulation, and its application to products. In recent years, signals in printed circuit boards have become faster and printed circuit boards have become close-packed so that noise immunity design has become difficult. In order to realize front-loading noise immunity design for multilayer printed circuit boards, fast electromagnetic simulation is indispensible. For evaluation of the fast electromagnetic simulation, a printed circuit board was manufactured, and the coupling of its power patterns was measured and simulated. The measurement results agree with the simulation results within 10 %.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) noise immunity / electromagnetic simulation / printed circuit board
Paper # EMCJ2013-29
Date of Issue

Conference Information
Committee EMCJ
Conference Date 2013/7/4(1days)
Place (in Japanese) (See Japanese page)
Place (in English)
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair
Vice Chair
Secretary
Assistant

Paper Information
Registration To Electromagnetic Compatibility (EMCJ)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Noise immunity design for multilayer printed circuit boards using fast electromagnetic simulation
Sub Title (in English)
Keyword(1) noise immunity
Keyword(2) electromagnetic simulation
Keyword(3) printed circuit board
1st Author's Name Mamoru Kamikura
1st Author's Affiliation Advanced Technology R&D Center, Mitsubishi Electric Corporation()
2nd Author's Name Yuichiro Murata
2nd Author's Affiliation Advanced Technology R&D Center, Mitsubishi Electric Corporation
3rd Author's Name Yudai Yoneoka
3rd Author's Affiliation Advanced Technology R&D Center, Mitsubishi Electric Corporation
Date 2013-07-11
Paper # EMCJ2013-29
Volume (vol) vol.113
Number (no) 122
Page pp.pp.-
#Pages 4
Date of Issue