Presentation 2013-05-17
Magnetic Pulse Welding of Copper Foils on Rigid and Flexible Printed Circuit Boards
Tomokatsu AIZAWA,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) This paper describes a novel welding technique for copper foils on rigid and flexible printed circuit boards and its experimental results. When a discharge current from a capacitor bank passes through a flat one-turn coil, a magnetic flux is suddenly generated around the coil. Eddy currents are induced in the overlapped copper foils and an insulated aluminum driver sheet placed on the coil. The foils have a gap between them. Electromagnetic force acts on the driver sheet and lets the copper foils collide. The foils can be welded both by the impact effect of the collision and by the Joule heat generated in them. The foils do not melt. The bank energy required for this welding is less than 1.3 kJ.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Printed circuit board / Rigid board / Flexible board / Copper foil / Magnetic pulse welding / Electromagnetic force
Paper # EMD2013-1
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Conference Information
Committee EMD
Conference Date 2013/5/10(1days)
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Paper Information
Registration To Electromechanical Devices (EMD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Magnetic Pulse Welding of Copper Foils on Rigid and Flexible Printed Circuit Boards
Sub Title (in English)
Keyword(1) Printed circuit board
Keyword(2) Rigid board
Keyword(3) Flexible board
Keyword(4) Copper foil
Keyword(5) Magnetic pulse welding
Keyword(6) Electromagnetic force
1st Author's Name Tomokatsu AIZAWA
1st Author's Affiliation Tokyo Metropolitan College of Industrial Technology()
Date 2013-05-17
Paper # EMD2013-1
Volume (vol) vol.113
Number (no) 48
Page pp.pp.-
#Pages 4
Date of Issue