Presentation 2013-05-20
Proposal of a Dependable Fine-grained Reconfigurable Device with ECC Technology
Yuki YOSHIDA, Kentaro TAKAKI, Kazuya TANIGAWA, Tetsuo HIRONAKA, Kenichi SHIMOMAI, Takashi ISHIGURO,
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Abstract(in English) Soft errors by cosmic rays and noise in a Field Programmable Gate Array (FPGA) are getting a big problem since the semiconductor's technology used for fabrication of FPGA is scaling down. So, we propose a dependable fine-grained reconfigurable device which has a softerror tolerance. The soft errors seen in the configuration memory of the proposed device is prevented by adopting Error Check and Correction (ECC) technology into the configuration memory. In this paper, we show the design of the proposed reconfigurable device with ECC technology based on two types of hamming codes, and also discuss the increase of hardware quantity needed on the implementation.
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Keyword(in English) MPLD / PLD / FPGA
Paper # RECONF2013-6
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Conference Information
Committee RECONF
Conference Date 2013/5/13(1days)
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Registration To Reconfigurable Systems (RECONF)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Proposal of a Dependable Fine-grained Reconfigurable Device with ECC Technology
Sub Title (in English)
Keyword(1) MPLD
Keyword(2) PLD
Keyword(3) FPGA
1st Author's Name Yuki YOSHIDA
1st Author's Affiliation Graduate School of Information Sciences, Hiroshima City University()
2nd Author's Name Kentaro TAKAKI
2nd Author's Affiliation Graduate School of Information Sciences, Hiroshima City University
3rd Author's Name Kazuya TANIGAWA
3rd Author's Affiliation Graduate School of Information Sciences, Hiroshima City University
4th Author's Name Tetsuo HIRONAKA
4th Author's Affiliation Graduate School of Information Sciences, Hiroshima City University
5th Author's Name Kenichi SHIMOMAI
5th Author's Affiliation Taiyo Yuden Co.,Ltd
6th Author's Name Takashi ISHIGURO
6th Author's Affiliation Taiyo Yuden Co.,Ltd
Date 2013-05-20
Paper # RECONF2013-6
Volume (vol) vol.113
Number (no) 52
Page pp.pp.-
#Pages 6
Date of Issue