Presentation 2013-01-16
A Study of 3D FPGA Architecture Using Face-to-Face Stacked Routing Layer
Yusuke IWAI, Qian ZHAO, Motoki AMAGASAKI, Masahiro IIDA, Morihiro KUGA, Toshinori SUEYOSHI,
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Abstract(in English) 3D LSIs promise More than Moore integration by packing a great deal of functionality on a chip, while improving performance and reducing costs. We have developed 3D-FPGAs which has two separate layers which is both logic parts and routing parts, respectively. In this paper we propose channel width exploring methods for our 3D-FPGA and evaluation execute compare with traditional 2D-FPGA architecture. As the results of evaluation, proposed 3D-FPGA is 24% less area and 27% faster delay than 2D-FPGA on average.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) FPGA / 3D-LSI / routing architecture / microbump / Face to Face stack
Paper # VLD2012-109,CPSY2012-58,RECONF2012-63
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Committee RECONF
Conference Date 2013/1/9(1days)
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Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A Study of 3D FPGA Architecture Using Face-to-Face Stacked Routing Layer
Sub Title (in English)
Keyword(1) FPGA
Keyword(2) 3D-LSI
Keyword(3) routing architecture
Keyword(4) microbump
Keyword(5) Face to Face stack
1st Author's Name Yusuke IWAI
1st Author's Affiliation Graduate School of Science and Technology, Kumamoto University()
2nd Author's Name Qian ZHAO
2nd Author's Affiliation Graduate School of Science and Technology, Kumamoto University
3rd Author's Name Motoki AMAGASAKI
3rd Author's Affiliation Graduate School of Science and Technology, Kumamoto University
4th Author's Name Masahiro IIDA
4th Author's Affiliation Graduate School of Science and Technology, Kumamoto University
5th Author's Name Morihiro KUGA
5th Author's Affiliation Graduate School of Science and Technology, Kumamoto University
6th Author's Name Toshinori SUEYOSHI
6th Author's Affiliation Graduate School of Science and Technology, Kumamoto University
Date 2013-01-16
Paper # VLD2012-109,CPSY2012-58,RECONF2012-63
Volume (vol) vol.112
Number (no) 377
Page pp.pp.-
#Pages 6
Date of Issue