Presentation 2012-09-18
Castle of Chips : A reconfigurable technique for multiple chips implementation
Hideharu AMANO,
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Abstract(in English) The number of stacked chips with wireless inductive coupling interconnect is limited by the physical space for bonding wires of supply voltage. A new chip stacking structure called CoC(Castle on Chips)is proposed for stacking a large number of chips without chip-to-chip wired interconnection. In the CoC, each chip has at least two sets of inductors, and is stacked on two chips in the lower layer shifting in the half chip size. Each chip takes a role of bridge of two chips in the lower layer and two in the upper layer. As examples of the CoC, linear structure and circular structure are proposed. They form stairway boundary mesh structure, and a simple extension of Dimension Order Routing(DOR)can be deadlock free if enough number of chips is stacked. The average distance of stairway boundary mesh is better than that of rectangular mesh, and sometimes comparable that of squire mesh. The circular stacking is advantageous when the number of stacking layers is strictly limited.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Inductive coupling interconnect / Interconnection Network / Chip level reconfiguration
Paper # RECONF2012-33
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Conference Information
Committee RECONF
Conference Date 2012/9/11(1days)
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Paper Information
Registration To Reconfigurable Systems (RECONF)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Castle of Chips : A reconfigurable technique for multiple chips implementation
Sub Title (in English)
Keyword(1) Inductive coupling interconnect
Keyword(2) Interconnection Network
Keyword(3) Chip level reconfiguration
1st Author's Name Hideharu AMANO
1st Author's Affiliation Graduate School of Science and Technology Keio University()
Date 2012-09-18
Paper # RECONF2012-33
Volume (vol) vol.112
Number (no) 203
Page pp.pp.-
#Pages 6
Date of Issue