Presentation 2012-12-21
Fundamental Experiments for Magnetic Pulse Welding of Electric and Electronic Parts
Tomokatsu Aizawa,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Copper and aluminum materials such as a sheet, foil, a terminal board, a wire are connected by magnetic pulse welding (MPW) method as fundamental experiments for MPW of electric and electronic parts. MPW is a cold process for lap welding of conductive metals having a gap. MPW uses magnetic pressure to drive a flyer metal material against a target metal material sweeping away surface contaminants by metal jets while forcing intimate metal-to-metal contact, thereby producing a solid-state weld. The flyer and the target materials are fixed on a flat one-turn coil and the discharge current from a capacitor bank passes through the coil to generate magnetic pressure. Many experimental results including appearances and joining interfaces of various welded materials are reported with a principle and methods of MPW.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Electro-conductive connection / Copper sheet / Aluminum sheet / Foil / Flexible printed circuit board / Terminal board / Lap welding / Magnetic pulse welding
Paper # EMD2012-92
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Conference Information
Committee EMD
Conference Date 2012/12/14(1days)
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Paper Information
Registration To Electromechanical Devices (EMD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Fundamental Experiments for Magnetic Pulse Welding of Electric and Electronic Parts
Sub Title (in English)
Keyword(1) Electro-conductive connection
Keyword(2) Copper sheet
Keyword(3) Aluminum sheet
Keyword(4) Foil
Keyword(5) Flexible printed circuit board
Keyword(6) Terminal board
Keyword(7) Lap welding
Keyword(8) Magnetic pulse welding
1st Author's Name Tomokatsu Aizawa
1st Author's Affiliation Tokyo Metropolitan College of Industrial Technology()
Date 2012-12-21
Paper # EMD2012-92
Volume (vol) vol.112
Number (no) 370
Page pp.pp.-
#Pages 6
Date of Issue