| Presentation | 2012-11-27 Novel Packaging Design by Appling Metamaterial Structures Takashi HARADA, Hiroshi TOYAO, Yoshiaki KASAHARA, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | As the downsizing of wireless equipment and components, the demands of efficient noise reducing technologies and small size antenna corresponding to high-density packaging become strong. On the other hand, metamaterial, which is one of the novel packaging structure, attracts attention as new implementation method to meet such demands in recent years. This report introduces an electromagnetic interference reduction technology using EBG (Electromagnetic Band Gap)structure and a small antenna design using a split ring resonator. These are kinds of metamaterial. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Metamaterial / EMC / Electromagnetic band gap / Antenna / Sprit-ring resonator |
| Paper # | CPM2012-116,ICD2012-80 |
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| Conference Information | |
| Committee | CPM |
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| Conference Date | 2012/11/20(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
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| Vice Chair | |
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| Paper Information | |
| Registration To | Component Parts and Materials (CPM) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Novel Packaging Design by Appling Metamaterial Structures |
| Sub Title (in English) | |
| Keyword(1) | Metamaterial |
| Keyword(2) | EMC |
| Keyword(3) | Electromagnetic band gap |
| Keyword(4) | Antenna |
| Keyword(5) | Sprit-ring resonator |
| 1st Author's Name | Takashi HARADA |
| 1st Author's Affiliation | C&C Innovation Initiative, NEC Corporation() |
| 2nd Author's Name | Hiroshi TOYAO |
| 2nd Author's Affiliation | Green Platform Laboratories, NEC Corporation |
| 3rd Author's Name | Yoshiaki KASAHARA |
| 3rd Author's Affiliation | C&C Innovation Initiative, NEC Corporation |
| Date | 2012-11-27 |
| Paper # | CPM2012-116,ICD2012-80 |
| Volume (vol) | vol.112 |
| Number (no) | 323 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |