| Presentation | 2012-11-27 Expectations to 2.5D/3D Package and Challenges on Package Design Hiroyuki MORI, Kazushige TORIYAMA, Yasumitsu ORII, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | Since internet becomes common and it is widely utilized, the quantity of the data to be handled rapidly grows up. In order to deal with such huge data, the role of a high performance computer and a portable device is very important. However, it is said that the data bandwidth for the device-device communication is not enough in order for high speed computing. At same time, the power consumption of the device is also restricting a device performance improvement. A 2.5D/3D stacked device structure has been proposed and it contributes to expand the bandwidth, to reduce the power consumption of the device and to miniaturize the product. Also, it makes much of benefit for applications. In this paper, the expectations to the 2.5D/3D stacked device and the challenges to the such package design are discussed. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Stacked device / 2.5D / 3D / Silicon interposer |
| Paper # | CPM2012-114,ICD2012-78 |
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| Conference Information | |
| Committee | CPM |
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| Conference Date | 2012/11/20(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
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| Vice Chair | |
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| Paper Information | |
| Registration To | Component Parts and Materials (CPM) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Expectations to 2.5D/3D Package and Challenges on Package Design |
| Sub Title (in English) | |
| Keyword(1) | Stacked device |
| Keyword(2) | 2.5D |
| Keyword(3) | 3D |
| Keyword(4) | Silicon interposer |
| 1st Author's Name | Hiroyuki MORI |
| 1st Author's Affiliation | Science & Technology, IBM Research Tokyo, IBM Japan, Ltd.() |
| 2nd Author's Name | Kazushige TORIYAMA |
| 2nd Author's Affiliation | Science & Technology, IBM Research Tokyo, IBM Japan, Ltd. |
| 3rd Author's Name | Yasumitsu ORII |
| 3rd Author's Affiliation | Science & Technology, IBM Research Tokyo, IBM Japan, Ltd. |
| Date | 2012-11-27 |
| Paper # | CPM2012-114,ICD2012-78 |
| Volume (vol) | vol.112 |
| Number (no) | 323 |
| Page | pp.pp.- |
| #Pages | 4 |
| Date of Issue | |