Presentation 2012-11-29
Electrical Properties of Si-Based Heterojunctions by Surface-Activated Bonding
Jianbo LIANG, Naoteru SHIGEGAWA, Eiji HIGURASHI,
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Abstract(in English) The electrical properties of Si/Si, Si/GaN and Si/GaAs junctions fabricated by using surface-activated bonding (SAB) were investigated. Current-voltage (I-V) characteristics of n-Si/n-Si and n-Si/n-GaN junctions indicated ohmic features at room temperature. The I-V characteristics of respective n-Si/n-Si dice were close to one another. No mechanical deficits were observed in n-Si/n-GaN junctions after measurements in varied temperatures. The p-Si/n-GaAs junctions revealed good rectifying properties. Their flat-band voltage was around 1.6V, which is close to the diffusion potential calculated for p-Si/n-GaAs heterojunctions with no electric charges placed at the interface. These results indicate that the SAB is potentially applicable for fabricating novel devices.
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Keyword(in English) Surface-activated bonding / current-voltage characteristics / trap-assisted tunneling / heterojunctions / GaN / GaAs / hybrid tandem solar cell
Paper # ED2012-65,CPM2012-122,LQE2012-93
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Committee ED
Conference Date 2012/11/22(1days)
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Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Electrical Properties of Si-Based Heterojunctions by Surface-Activated Bonding
Sub Title (in English)
Keyword(1) Surface-activated bonding
Keyword(2) current-voltage characteristics
Keyword(3) trap-assisted tunneling
Keyword(4) heterojunctions
Keyword(5) GaN
Keyword(6) GaAs
Keyword(7) hybrid tandem solar cell
1st Author's Name Jianbo LIANG
1st Author's Affiliation Graduate School of Engineering, Osaka City University()
2nd Author's Name Naoteru SHIGEGAWA
2nd Author's Affiliation Graduate School of Engineering, Osaka City University
3rd Author's Name Eiji HIGURASHI
3rd Author's Affiliation RCAST, Univ. of Tokyo
Date 2012-11-29
Paper # ED2012-65,CPM2012-122,LQE2012-93
Volume (vol) vol.112
Number (no) 327
Page pp.pp.-
#Pages 5
Date of Issue