Presentation 2012-08-03
Nanocarbon Interconnects : Aiming to replace ultra-fine metal interconnects
Akihiro Kajita, Makoto Wada, Tatsuro Saito, Masayuki Kitamura, Yuichi Yamazaki, Masayuki Katagiri, Ban Ito, Daisuke Nishide, Takashi Matsumoto, Atsunobu Isobayashi, Mariko Suzuki, Atsuko Sakata, Masahito Watanabe, Naoshi Sakuma, Tadashi Sakai,
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Abstract(in English) The width of interconnects has been shrinking toward 10nm in accordance with LSI devices shrinkage. The resistivity of such ultra-fine metal interconnects increases steeply, because the size effect on the resistivity becomes pronounced. On the other hand, interconnects with nano-carbon materials like graphene and CNT are expected to have the resistance which doesn't depend on the size due to their unique conduction mechanism. So, nano-carbon interconnects have a potential to substitute urtra-fine metal interconnects and/or metal vias with very high aspect ratio. LEAP has developed both graphene wires and CNT vias in order to be applied to the future interconnects. Some challenges to grow graphene and CNT by CVD, which is suitable for LSI fabrication process, are shown.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Interconnect / Nanocarbon / Graphene / Carbon Nano Tube
Paper # SDM2012-78,ICD2012-46
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Conference Information
Committee ICD
Conference Date 2012/7/26(1days)
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Paper Information
Registration To Integrated Circuits and Devices (ICD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Nanocarbon Interconnects : Aiming to replace ultra-fine metal interconnects
Sub Title (in English)
Keyword(1) Interconnect
Keyword(2) Nanocarbon
Keyword(3) Graphene
Keyword(4) Carbon Nano Tube
1st Author's Name Akihiro Kajita
1st Author's Affiliation Low-power Electronics Association & Project (LEAP)()
2nd Author's Name Makoto Wada
2nd Author's Affiliation Low-power Electronics Association & Project (LEAP)
3rd Author's Name Tatsuro Saito
3rd Author's Affiliation Low-power Electronics Association & Project (LEAP)
4th Author's Name Masayuki Kitamura
4th Author's Affiliation Low-power Electronics Association & Project (LEAP)
5th Author's Name Yuichi Yamazaki
5th Author's Affiliation Low-power Electronics Association & Project (LEAP)
6th Author's Name Masayuki Katagiri
6th Author's Affiliation Low-power Electronics Association & Project (LEAP)
7th Author's Name Ban Ito
7th Author's Affiliation Low-power Electronics Association & Project (LEAP)
8th Author's Name Daisuke Nishide
8th Author's Affiliation Low-power Electronics Association & Project (LEAP)
9th Author's Name Takashi Matsumoto
9th Author's Affiliation Low-power Electronics Association & Project (LEAP)
10th Author's Name Atsunobu Isobayashi
10th Author's Affiliation Low-power Electronics Association & Project (LEAP)
11th Author's Name Mariko Suzuki
11th Author's Affiliation Low-power Electronics Association & Project (LEAP)
12th Author's Name Atsuko Sakata
12th Author's Affiliation Low-power Electronics Association & Project (LEAP)
13th Author's Name Masahito Watanabe
13th Author's Affiliation Low-power Electronics Association & Project (LEAP)
14th Author's Name Naoshi Sakuma
14th Author's Affiliation Low-power Electronics Association & Project (LEAP)
15th Author's Name Tadashi Sakai
15th Author's Affiliation Low-power Electronics Association & Project (LEAP)
Date 2012-08-03
Paper # SDM2012-78,ICD2012-46
Volume (vol) vol.112
Number (no) 170
Page pp.pp.-
#Pages 5
Date of Issue