Presentation 2012-08-09
Formation Process of Reactively-sputtered Nano-crystalline ZrN_x Barrier Films
Masaru SATO, Mayumi B. TAKEYAMA, Eiji AOYAGI, Atsushi NOYA,
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Abstract(in English) Thin diffusion barriers of high performance in several nm thicknesses are required as the size of Cu multilevel interconnects is scaled down. We have demonstrated that a reactively sputtered ZrN_x thin barrier in nanocrystalline texture meets this requirement. In this study, we investigate the process and conditions to form nanocrystalline textured ZrN_x thin films by reactive sputtering consulting the structure zone model by Thornton. Considering the surface mobility of incoming ad-molecules and growth process, we find two solutions to form nanocrystalline phase by choosing sputtering conditions of proper nitrogen composition in the sputtering gas, substrate temperature and target voltage. The stability of ZrN_x phase as a non-stoichiometry compound also contributes the wide variation of sputtering conditions examined.
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Keyword(in English) Cu interconnects / Extremely thin barrier / ZrN / Nano-crystalline / Reactive sputtering
Paper # CPM2012-44
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Committee CPM
Conference Date 2012/8/1(1days)
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Language JPN
Title (in Japanese) (See Japanese page)
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Title (in English) Formation Process of Reactively-sputtered Nano-crystalline ZrN_x Barrier Films
Sub Title (in English)
Keyword(1) Cu interconnects
Keyword(2) Extremely thin barrier
Keyword(3) ZrN
Keyword(4) Nano-crystalline
Keyword(5) Reactive sputtering
1st Author's Name Masaru SATO
1st Author's Affiliation Faculty of Engineering, Kitami Institute of Technology()
2nd Author's Name Mayumi B. TAKEYAMA
2nd Author's Affiliation Faculty of Engineering, Kitami Institute of Technology
3rd Author's Name Eiji AOYAGI
3rd Author's Affiliation Institute for Materials Research, Tohoku University
4th Author's Name Atsushi NOYA
4th Author's Affiliation Faculty of Engineering, Kitami Institute of Technology
Date 2012-08-09
Paper # CPM2012-44
Volume (vol) vol.112
Number (no) 175
Page pp.pp.-
#Pages 5
Date of Issue