| Presentation | 2012-07-26 Mold type power module Hiroshi USUI, |
|---|---|
| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | In recent years, there is a trend of smaller and lighter power supply. The large parts such as transformers, inductor and capacitor are used. And they are molded. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Mold / Module / Switching Power supply / insulation / Higher frequency |
| Paper # | ICD2012-21 |
| Date of Issue |
| Conference Information | |
| Committee | ICD |
|---|---|
| Conference Date | 2012/7/19(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Integrated Circuits and Devices (ICD) |
|---|---|
| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Mold type power module |
| Sub Title (in English) | |
| Keyword(1) | Mold |
| Keyword(2) | Module |
| Keyword(3) | Switching Power supply |
| Keyword(4) | insulation |
| Keyword(5) | Higher frequency |
| 1st Author's Name | Hiroshi USUI |
| 1st Author's Affiliation | Sanken Electric Co., Ltd.() |
| Date | 2012-07-26 |
| Paper # | ICD2012-21 |
| Volume (vol) | vol.112 |
| Number (no) | 159 |
| Page | pp.pp.- |
| #Pages | 5 |
| Date of Issue | |