Presentation 2012-07-26
Effects of annealing on DC performance of AlGaN/GaN MIS HEMTs
Maiko HATANO, Yuya TANIGUCHI, Hirokuni TOKUDA, Masaaki KUZUHARA,
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Abstract(in English) We present DC characteristics of AlGaN/GaN MIS HEMTs and discuss the effects of post annealing on the DC performance. The threshold voltage exhibited a negative shift for HEMTs annealed at 500℃ before gate metal deposition. On the other hand, the device annealed after gate metal deposition exhibited a positive shift in threshold voltage and a decrease in leakage current. These results suggest that metal/Al_2O_3 interface barrier height was increased by annealing after gate metal deposition. Without affecting the value of R_ and g_ the leakage current was reduced by annealing at 500℃ after gate metal deposition.
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Keyword(in English) AlGaN/GaN / HEMT / annealing effect
Paper # ED2012-41
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Committee ED
Conference Date 2012/7/19(1days)
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Registration To Electron Devices (ED)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Effects of annealing on DC performance of AlGaN/GaN MIS HEMTs
Sub Title (in English)
Keyword(1) AlGaN/GaN
Keyword(2) HEMT
Keyword(3) annealing effect
1st Author's Name Maiko HATANO
1st Author's Affiliation Graduate School of Engineering, University of Fukui()
2nd Author's Name Yuya TANIGUCHI
2nd Author's Affiliation Graduate School of Engineering, University of Fukui
3rd Author's Name Hirokuni TOKUDA
3rd Author's Affiliation Graduate School of Engineering, University of Fukui
4th Author's Name Masaaki KUZUHARA
4th Author's Affiliation Graduate School of Engineering, University of Fukui
Date 2012-07-26
Paper # ED2012-41
Volume (vol) vol.112
Number (no) 154
Page pp.pp.-
#Pages 4
Date of Issue