Presentation 2012-05-18
Evaluation of GaN substrates for vertical GaN power device applications
Tetsu KACHI, Tsutomu UESUGI,
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Abstract(in English) Effects of dislocations in GaN substrates to leakage current have been evaluated using pn and Shottky diodes. The results revealed that the edge dislocations and mix dislocations don't induce the leakage current even at > 1kV reverse bias.
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Keyword(in English) GaN substrate / threading dislocation / edge dislocation / mix dislocation / leakage current
Paper # ED2012-28,CPM2012-12,SDM2012-30
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Committee ED
Conference Date 2012/5/10(1days)
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Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Evaluation of GaN substrates for vertical GaN power device applications
Sub Title (in English)
Keyword(1) GaN substrate
Keyword(2) threading dislocation
Keyword(3) edge dislocation
Keyword(4) mix dislocation
Keyword(5) leakage current
1st Author's Name Tetsu KACHI
1st Author's Affiliation Toyota Central R&D Labs., Inc.()
2nd Author's Name Tsutomu UESUGI
2nd Author's Affiliation Toyota Central R&D Labs., Inc.
Date 2012-05-18
Paper # ED2012-28,CPM2012-12,SDM2012-30
Volume (vol) vol.112
Number (no) 32
Page pp.pp.-
#Pages 4
Date of Issue