| Presentation | 2012-05-24 60-GHz Band Beamforming Array Antenna Using 3-D SiP Structure(Technology Exhibit) Satoshi YOSHIDA, Yuya SUZUKI, Than Thanh TA, Suguru KAMEDA, Noriharu SUEMATSU, Tadashi TAKAGI, Kazuo TSUBOUCHI, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | In this paper, a 60-GHz band planar dipole array antenna structure in a small wireless terminal is proposed for wide coverage area beamforming application. Five substrates are stacked vertically using the 3-dimensional (3-D) system-in-package (SiP) technology, and the element antenna is arranged in the top and bottom substrates. A planar dipole antenna is used as an element antenna. As a result of the design using the numerical simulation and 3-D electromagnetic field simulation, 4×2 arrangement is feasible structure for a small wireless terminal with wide coverage area. Measured results show the designed array antenna has wide coverage area, which covers 70 degree and 90 degree for theta and phi direction with the gain exceeds 10 dBi, respectively. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Millimeter-Wave / Multilayered Substrate / Planar Antenna / Beamforming / 60 GHz / System-in-Package (SiP) |
| Paper # | SR2012-1 |
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| Conference Information | |
| Committee | SR |
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| Conference Date | 2012/5/17(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
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| Vice Chair | |
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| Paper Information | |
| Registration To | Software Radio(SR) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | 60-GHz Band Beamforming Array Antenna Using 3-D SiP Structure(Technology Exhibit) |
| Sub Title (in English) | |
| Keyword(1) | Millimeter-Wave |
| Keyword(2) | Multilayered Substrate |
| Keyword(3) | Planar Antenna |
| Keyword(4) | Beamforming |
| Keyword(5) | 60 GHz |
| Keyword(6) | System-in-Package (SiP) |
| 1st Author's Name | Satoshi YOSHIDA |
| 1st Author's Affiliation | Research Institute of Electrical Communication, Tohoku University() |
| 2nd Author's Name | Yuya SUZUKI |
| 2nd Author's Affiliation | Research Institute of Electrical Communication, Tohoku University |
| 3rd Author's Name | Than Thanh TA |
| 3rd Author's Affiliation | Research Institute of Electrical Communication, Tohoku University |
| 4th Author's Name | Suguru KAMEDA |
| 4th Author's Affiliation | Research Institute of Electrical Communication, Tohoku University |
| 5th Author's Name | Noriharu SUEMATSU |
| 5th Author's Affiliation | Research Institute of Electrical Communication, Tohoku University |
| 6th Author's Name | Tadashi TAKAGI |
| 6th Author's Affiliation | Research Institute of Electrical Communication, Tohoku University |
| 7th Author's Name | Kazuo TSUBOUCHI |
| 7th Author's Affiliation | Research Institute of Electrical Communication, Tohoku University |
| Date | 2012-05-24 |
| Paper # | SR2012-1 |
| Volume (vol) | vol.112 |
| Number (no) | 55 |
| Page | pp.pp.- |
| #Pages | 8 |
| Date of Issue | |