| Presentation | 2012-01-26 Measurement of IC Package Inductance with Transmission Line Embedded in Package Kengo IOKIBE, Ayumi TANIMICHI, Yoshitaka TOYOTA, |
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| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | It is of importance for designers to possess accurate inductances of IC packages in power integrity(PI) and electromagnetic compatibility designs. The authors had proposed a simple method to measure inductance of IC package that is mounted on a practical printed circuit board. They investigated the method in terms of accuracy here. In the proposed method, a transmission line is embedded in an IC package interested, and two port S parameters of a network composed of a targeted package structure, the transmission line, and the corresponding symmetric package structure is measured. The package inductance is calculated from the measured S parameters and properties of the transmission line obtained beforehand. The proposed method was applied to four test IC packages, and their inductances were measured. The measurement was demonstrated on a commercial electromagnetic simulator, HFSS. The package inductances were also obtained by analyzing the test package directly for comparison to the results of the proposed method. They agreed with the maximum error of 0.9 nH. To understand a cause of the error, the authors investigated effects of dummy-objects that were used to place measuring ports in the HFSS calculation. The dummy-object caused errors less than 0.06 nH, which means it seldom cause significant errors. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | IC/LSI / Package / Self-Inductance / Power integrity / Electromagnetic compatibility / Power distribution network |
| Paper # | PN2011-35,OPE2011-151,LQE2011-137,EST2011-85,MWP2011-53 |
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| Conference Information | |
| Committee | EST |
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| Conference Date | 2012/1/19(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
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| Paper Information | |
| Registration To | Electronic Simulation Technology (EST) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Measurement of IC Package Inductance with Transmission Line Embedded in Package |
| Sub Title (in English) | |
| Keyword(1) | IC/LSI |
| Keyword(2) | Package |
| Keyword(3) | Self-Inductance |
| Keyword(4) | Power integrity |
| Keyword(5) | Electromagnetic compatibility |
| Keyword(6) | Power distribution network |
| 1st Author's Name | Kengo IOKIBE |
| 1st Author's Affiliation | Graduate School of Natural Science and Technology, Okayama University() |
| 2nd Author's Name | Ayumi TANIMICHI |
| 2nd Author's Affiliation | Graduate School of Natural Science and Technology, Okayama University |
| 3rd Author's Name | Yoshitaka TOYOTA |
| 3rd Author's Affiliation | Graduate School of Natural Science and Technology, Okayama University |
| Date | 2012-01-26 |
| Paper # | PN2011-35,OPE2011-151,LQE2011-137,EST2011-85,MWP2011-53 |
| Volume (vol) | vol.111 |
| Number (no) | 415 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |