Presentation 2011-11-17
Decreasing Dislocation Density of MOCVD-GaN Using Silicon Dioxide Mask
Masaru TANIMOTO, Shiro SAKAI,
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Abstract(in English) Epitaxial Lateral Overgrowth (ELO) is done for GaN with a cross-hatch pattemed-SiO_2. The easier plane for the re-growth of GaN is a GaN (0001) plane, and that the non-easy plane is for GaN is other planes of GaN and sapphire. By just increase of etching time of SiO_2, the easier re-growth plane of GaN is nucleated on the 0.5 μm-thick-GaN. The etch pit density of 2.1×10^7cm^<-2> is obtained, while the normal GaN shows 3.0×10^8cm^<-2>. The Shottky barrier is fabricated, and the best one seems the saturation current is the lowest.
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Keyword(in English) GaN / Dislocation Density / etching
Paper # ED2011-76,CPM2011-125,LQE2011-99
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Committee CPM
Conference Date 2011/11/10(1days)
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Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Decreasing Dislocation Density of MOCVD-GaN Using Silicon Dioxide Mask
Sub Title (in English)
Keyword(1) GaN
Keyword(2) Dislocation Density
Keyword(3) etching
1st Author's Name Masaru TANIMOTO
1st Author's Affiliation Faculty of Engineering, The University of Tokushima()
2nd Author's Name Shiro SAKAI
2nd Author's Affiliation Faculty of Engineering, The University of Tokushima
Date 2011-11-17
Paper # ED2011-76,CPM2011-125,LQE2011-99
Volume (vol) vol.111
Number (no) 291
Page pp.pp.-
#Pages 4
Date of Issue