Presentation 2011-10-26
Formation of NiSi silicide and its application to Cu contacts
Mayumi B. TAKEYAMA, Masaru SATO, Atsushi NOYA,
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Abstract(in English) Monosilicide of NiSi is attractive due to its low resistivity, phase stability up to at 750℃, the phase transition point to NiSi_2, and smaller Si consumption during silicidation reaction than those of disilicides. In this study, we have proposed and examined an increased transition temperature from NiSi to NiSia by controlling the texture of NiSi. As a result, by choosing the reaction temperature of 380℃, close to 350℃ the formation temperature of NiSi, we can obtain a uniform NiSi film with decreased crystalline grains. In such a film, the NiSi phase is still stable at the temperature of 750℃. It is revealed that the nanocrystalline texture of NiSi is effective for improving the stability of the NiSi phase. The degradation process of the Cu/NiSi/Si contact is examined for the application of Cu plugs in the contacts. The Cu diffusion into the NiSi layer starts at 350℃ forming Cu-silicides. This solid-phase reaction leads to the degradation of the contact. The use of a barrier layer is suggestive between Cu and NiSi.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Cu plug / Ni-silicides / low resistivity / phase transition / front end
Paper # CPM2011-117
Date of Issue

Conference Information
Committee CPM
Conference Date 2011/10/19(1days)
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Paper Information
Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Formation of NiSi silicide and its application to Cu contacts
Sub Title (in English)
Keyword(1) Cu plug
Keyword(2) Ni-silicides
Keyword(3) low resistivity
Keyword(4) phase transition
Keyword(5) front end
1st Author's Name Mayumi B. TAKEYAMA
1st Author's Affiliation Faculty of Engineering, Kitami institute of technology()
2nd Author's Name Masaru SATO
2nd Author's Affiliation Faculty of Engineering, Kitami institute of technology
3rd Author's Name Atsushi NOYA
3rd Author's Affiliation Faculty of Engineering, Kitami institute of technology
Date 2011-10-26
Paper # CPM2011-117
Volume (vol) vol.111
Number (no) 264
Page pp.pp.-
#Pages 5
Date of Issue