Presentation 2011-08-25
Compact optical sub-assembly using lens-integrated high-k low-Tg material
Takashi Shiraishi, Takatoshi Yagisawa, Tadashi Ikeuchi, Satoshi Ide, Kazuhiro Tanaka,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) We have developed cost-effective optical sub-assembly using lens-integrated high-dielectric constant (high-k), low-glass-transient temperature (low-Tg) glass as substrate. We fabricated a 4-channel compact optical transceiver sub-assembly measuring 7.9 x 7.9 x 1.1 mm. Error-free operation was achieved at up to 14Gb/s.
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Keyword(in English) High-k / Low-Tg / glass / Polymer Waveguides / VCSEL / Photodiode / Optical interconnection / Flip chip
Paper # EMD2011-38,CPM2011-82,OPE2011-73,LQE2011-36
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Conference Information
Committee CPM
Conference Date 2011/8/18(1days)
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Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Compact optical sub-assembly using lens-integrated high-k low-Tg material
Sub Title (in English)
Keyword(1) High-k
Keyword(2) Low-Tg
Keyword(3) glass
Keyword(4) Polymer Waveguides
Keyword(5) VCSEL
Keyword(6) Photodiode
Keyword(7) Optical interconnection
Keyword(8) Flip chip
1st Author's Name Takashi Shiraishi
1st Author's Affiliation Fujitsu Laboratories Ltd.()
2nd Author's Name Takatoshi Yagisawa
2nd Author's Affiliation Fujitsu Laboratories Ltd.
3rd Author's Name Tadashi Ikeuchi
3rd Author's Affiliation Fujitsu Laboratories Ltd.
4th Author's Name Satoshi Ide
4th Author's Affiliation Fujitsu Laboratories Ltd.
5th Author's Name Kazuhiro Tanaka
5th Author's Affiliation Fujitsu Laboratories Ltd.
Date 2011-08-25
Paper # EMD2011-38,CPM2011-82,OPE2011-73,LQE2011-36
Volume (vol) vol.111
Number (no) 184
Page pp.pp.-
#Pages 6
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