Presentation 2011-02-07
Dependence of Ti-Based Self-Formed Barrier Structure on Dielectric-Layer Composition
Kazuyuki KOHAMA, Kazuhiro ITO, Yutaka SONOBAYASHI, Kazuyuki OHMORI, Kenichi MORI, Kazuyoshi MAEKAWA, Yasuharu SHIRAI, Masanori MURAKAMI,
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Abstract(in English) Ti-based self-formed barrier layer using Cu(Ti) alloy seed applied to 45 nm-node dual-damascene interconnects was reported to have sufficient barrier strength to prevent Cu diffusion into dielectrics. However, the barrier structure such as a volume fraction and a position of the constituent Ti compounds were unknown. Thus, barrier mechanism of the self-formed Ti-based barrier layers was indistinct. In the present study, we employed an X-ray Photoelectron Spectroscopy (XPS) technique with simultaneous Ar etching, to investigate systematically the barrier structure of the Ti-based barrier layers self-formed on several dielectrics.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) LSI / Cu interconnect / Cu(Ti) / RBS / XPS
Paper # SDM2010-221
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Conference Information
Committee SDM
Conference Date 2011/1/31(1days)
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Registration To Silicon Device and Materials (SDM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Dependence of Ti-Based Self-Formed Barrier Structure on Dielectric-Layer Composition
Sub Title (in English)
Keyword(1) LSI
Keyword(2) Cu interconnect
Keyword(3) Cu(Ti)
Keyword(4) RBS
Keyword(5) XPS
1st Author's Name Kazuyuki KOHAMA
1st Author's Affiliation Dept. of Materials Science and Engineering, Kyoto Univ.()
2nd Author's Name Kazuhiro ITO
2nd Author's Affiliation Dept. of Materials Science and Engineering, Kyoto Univ.
3rd Author's Name Yutaka SONOBAYASHI
3rd Author's Affiliation Dept. of Materials Science and Engineering, Kyoto Univ.
4th Author's Name Kazuyuki OHMORI
4th Author's Affiliation Renesas Electronics Corporation
5th Author's Name Kenichi MORI
5th Author's Affiliation Renesas Electronics Corporation
6th Author's Name Kazuyoshi MAEKAWA
6th Author's Affiliation The Ritsumeikan Trust
7th Author's Name Yasuharu SHIRAI
7th Author's Affiliation Dept. of Materials Science and Engineering, Kyoto Univ. /
8th Author's Name Masanori MURAKAMI
8th Author's Affiliation
Date 2011-02-07
Paper # SDM2010-221
Volume (vol) vol.110
Number (no) 408
Page pp.pp.-
#Pages 5
Date of Issue