Presentation 2011-04-12
Note on Defect Level Evaluation of Cascaded TMR for Pipeline Processors
Masayuki Arai, Kazuhiko Iwasaki,
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Abstract(in English) In this study we evaluate effectiveness of cascaded triple modular redundancy (TMR) where TMR is applied to every stage of a pipeline processor, in respect to area per a good chip and defect level. For two different TMR arrangements, we theoretically derive area per a good chip based on given defect density and the number of stages. Also, assuming that production test is applied for each module and voter in every stage independently and that pass/fail of a chip is determined based on the test result, we theoretically derive defect level for given fault coverage. Numerical examples show that application of cascaded TMR improves area per a good chip and defect level in the case where manufactiiring yield is low, and also that there are some cases where the number of stages which minimizes area per a good chip or defect level exists.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) cascaded TMR / defect level / test escape / area per a good chip
Paper # CPSY2011-6,DC2011-6
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Committee DC
Conference Date 2011/4/5(1days)
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Registration To Dependable Computing (DC)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Note on Defect Level Evaluation of Cascaded TMR for Pipeline Processors
Sub Title (in English)
Keyword(1) cascaded TMR
Keyword(2) defect level
Keyword(3) test escape
Keyword(4) area per a good chip
1st Author's Name Masayuki Arai
1st Author's Affiliation Faculty of System Design, Tokyo Metropolitan University()
2nd Author's Name Kazuhiko Iwasaki
2nd Author's Affiliation Faculty of System Design, Tokyo Metropolitan University
Date 2011-04-12
Paper # CPSY2011-6,DC2011-6
Volume (vol) vol.111
Number (no) 2
Page pp.pp.-
#Pages 6
Date of Issue