Presentation 2011-01-14
AlGaN/GaN HFETs using highly C-doped layers on Si substrate
Takuya Kokawa, Syusuke Kaya, Nariaki Ikeda, Sadahiro Kato,
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Abstract(in English) In this paper, AlGaN/GaN/HFET devices on Si substrates were fabricated, and the device characteristics were examined. In order to improve a trade-off between the specific on-resistance(RonA) and the breakdown voltage(Vb), carbon was highly doped into a GaN layer, resulting in an improvement of Vb per unit gate-drain length (Lgd) without degrading on-state characteristics or current collapse.
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Keyword(in English) GaN / HFET / Si substrate / C doping / on-resistance / breakdown voltage
Paper # ED2010-185,MW2010-145
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Committee MW
Conference Date 2011/1/6(1days)
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Registration To Microwaves (MW)
Language JPN
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Title (in English) AlGaN/GaN HFETs using highly C-doped layers on Si substrate
Sub Title (in English)
Keyword(1) GaN
Keyword(2) HFET
Keyword(3) Si substrate
Keyword(4) C doping
Keyword(5) on-resistance
Keyword(6) breakdown voltage
1st Author's Name Takuya Kokawa
1st Author's Affiliation Advanced Power Device Research Association()
2nd Author's Name Syusuke Kaya
2nd Author's Affiliation Advanced Power Device Research Association
3rd Author's Name Nariaki Ikeda
3rd Author's Affiliation Advanced Power Device Research Association
4th Author's Name Sadahiro Kato
4th Author's Affiliation Advanced Power Device Research Association
Date 2011-01-14
Paper # ED2010-185,MW2010-145
Volume (vol) vol.110
Number (no) 359
Page pp.pp.-
#Pages 5
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