Presentation 2011-01-28
Effects of Resin-Clay Nanocomposites on the Ionic Migration Inhibitors in Ag-Printed Circuits
Yasuyuki OHTANI, Shin-ichiro NAKAJIMA,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Most of electric products has been progressed in downsizing with the packaging of the printed circuit board, which has escalated with high density. Therefore, one of the big problems includes the electrical breakdown due mainly to the ionic migration in the circuits. We have recently succeeded in developing the hybrid compound, which consists of a resin and an inorganic clay compound that can greatly inhibit the ionic migration of silver in the printed circuit board. We herein report on the synthesis and electrochemical properties of the hybrid compounds.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Printed circuit board / Ionic migration / Silver / Clay / Hybrid compound
Paper # EMD2010-140
Date of Issue

Conference Information
Committee EMD
Conference Date 2011/1/21(1days)
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Paper Information
Registration To Electromechanical Devices (EMD)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Effects of Resin-Clay Nanocomposites on the Ionic Migration Inhibitors in Ag-Printed Circuits
Sub Title (in English)
Keyword(1) Printed circuit board
Keyword(2) Ionic migration
Keyword(3) Silver
Keyword(4) Clay
Keyword(5) Hybrid compound
1st Author's Name Yasuyuki OHTANI
1st Author's Affiliation Product Development Center, Japan Aviation Electronics Industry, Ltd.()
2nd Author's Name Shin-ichiro NAKAJIMA
2nd Author's Affiliation Product Development Center, Japan Aviation Electronics Industry, Ltd.
Date 2011-01-28
Paper # EMD2010-140
Volume (vol) vol.110
Number (no) 403
Page pp.pp.-
#Pages 6
Date of Issue