Presentation | 2011-01-28 Effects of Resin-Clay Nanocomposites on the Ionic Migration Inhibitors in Ag-Printed Circuits Yasuyuki OHTANI, Shin-ichiro NAKAJIMA, |
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Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | Most of electric products has been progressed in downsizing with the packaging of the printed circuit board, which has escalated with high density. Therefore, one of the big problems includes the electrical breakdown due mainly to the ionic migration in the circuits. We have recently succeeded in developing the hybrid compound, which consists of a resin and an inorganic clay compound that can greatly inhibit the ionic migration of silver in the printed circuit board. We herein report on the synthesis and electrochemical properties of the hybrid compounds. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | Printed circuit board / Ionic migration / Silver / Clay / Hybrid compound |
Paper # | EMD2010-140 |
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Committee | EMD |
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Conference Date | 2011/1/21(1days) |
Place (in Japanese) | (See Japanese page) |
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Topics (in Japanese) | (See Japanese page) |
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Registration To | Electromechanical Devices (EMD) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Effects of Resin-Clay Nanocomposites on the Ionic Migration Inhibitors in Ag-Printed Circuits |
Sub Title (in English) | |
Keyword(1) | Printed circuit board |
Keyword(2) | Ionic migration |
Keyword(3) | Silver |
Keyword(4) | Clay |
Keyword(5) | Hybrid compound |
1st Author's Name | Yasuyuki OHTANI |
1st Author's Affiliation | Product Development Center, Japan Aviation Electronics Industry, Ltd.() |
2nd Author's Name | Shin-ichiro NAKAJIMA |
2nd Author's Affiliation | Product Development Center, Japan Aviation Electronics Industry, Ltd. |
Date | 2011-01-28 |
Paper # | EMD2010-140 |
Volume (vol) | vol.110 |
Number (no) | 403 |
Page | pp.pp.- |
#Pages | 6 |
Date of Issue |