Presentation 2010-11-11
AlN growth on SiC by LP-HVPE
Kenta OKUMURA, Takuya NOMURA, Hideto MIYAKE, Kazumasa HIRAMATSU, Osamu ERYUU,
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Abstract(in English) AlN films were grown on 6H-SiC. As the thickness of AlN layer increased, crack and peeling occurred, which was considered to be due to the difference in thermal expansion between the AlN layer and substrate. The patterned substrates are able to relax the stress incurred by AlN. Therefore AlN films were grown on patterned SiC with stripes along the <1-100> and <11-20> directions by hydride vapor phase epitaxy and characterized by scanning electron microscope, atomic force microscopy and high-resolution X-ray diffraction. Although the critical thickness of AlN can be increased significantly using both patterns, AlN grown on <1-100>-patterned SiC was more easily coalesced than that on the <11-20> pattern. Moreover, the surface morphology and crystal quality of samples grown on <1-100>-patterned SiC were better than those on <11-20>-patterned substrates.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) AlN / 6H-SiC / trench-pattern / HVPE
Paper # ED2010-146,CPM2010-112,LQE2010-102
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Conference Information
Committee LQE
Conference Date 2010/11/4(1days)
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Registration To Lasers and Quantum Electronics (LQE)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) AlN growth on SiC by LP-HVPE
Sub Title (in English)
Keyword(1) AlN
Keyword(2) 6H-SiC
Keyword(3) trench-pattern
Keyword(4) HVPE
1st Author's Name Kenta OKUMURA
1st Author's Affiliation Graduate school of Engineering, Mie University()
2nd Author's Name Takuya NOMURA
2nd Author's Affiliation Graduate school of Engineering, Mie University
3rd Author's Name Hideto MIYAKE
3rd Author's Affiliation Graduate school of Engineering, Mie University
4th Author's Name Kazumasa HIRAMATSU
4th Author's Affiliation Graduate school of Engineering, Mie University
5th Author's Name Osamu ERYUU
5th Author's Affiliation Nagoya Institute of Technology
Date 2010-11-11
Paper # ED2010-146,CPM2010-112,LQE2010-102
Volume (vol) vol.110
Number (no) 273
Page pp.pp.-
#Pages 4
Date of Issue