Presentation 2010-11-29
Present Status and Target Issue of LSI-Chip Optical Interconnection
Keishi OHASHI, Tohru MOGAMI,
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Abstract(in English) On-chip optical interconnection is expected to give an answer to the problems on signal integrity and data band width. Cost and foot print size issues associated with the optical technology have been improved by introducing silicon photonics and nanophotonics. A possibility how to change the optical interconnection changes the design of LSI interconnection will be discussed.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Optical Interconnection / Signal Integrity / Silicon Photonics / Wavelength-Division-Multiplexing / 3-D Integration
Paper # CPM2010-129,ICD2010-88
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Conference Information
Committee CPM
Conference Date 2010/11/22(1days)
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Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Present Status and Target Issue of LSI-Chip Optical Interconnection
Sub Title (in English)
Keyword(1) Optical Interconnection
Keyword(2) Signal Integrity
Keyword(3) Silicon Photonics
Keyword(4) Wavelength-Division-Multiplexing
Keyword(5) 3-D Integration
1st Author's Name Keishi OHASHI
1st Author's Affiliation MIRAI-Selete:Green Inovation Res. Labs, NEC Corporation()
2nd Author's Name Tohru MOGAMI
2nd Author's Affiliation MIRAI-Selete
Date 2010-11-29
Paper # CPM2010-129,ICD2010-88
Volume (vol) vol.110
Number (no) 314
Page pp.pp.-
#Pages 6
Date of Issue