| Presentation | 2010-11-29 Present Status and Target Issue of LSI-Chip Optical Interconnection Keishi OHASHI, Tohru MOGAMI, |
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| PDF Download Page |  PDF download Page Link |
| Abstract(in Japanese) | (See Japanese page) |
| Abstract(in English) | On-chip optical interconnection is expected to give an answer to the problems on signal integrity and data band width. Cost and foot print size issues associated with the optical technology have been improved by introducing silicon photonics and nanophotonics. A possibility how to change the optical interconnection changes the design of LSI interconnection will be discussed. |
| Keyword(in Japanese) | (See Japanese page) |
| Keyword(in English) | Optical Interconnection / Signal Integrity / Silicon Photonics / Wavelength-Division-Multiplexing / 3-D Integration |
| Paper # | CPM2010-129,ICD2010-88 |
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| Conference Information | |
| Committee | CPM |
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| Conference Date | 2010/11/22(1days) |
| Place (in Japanese) | (See Japanese page) |
| Place (in English) | |
| Topics (in Japanese) | (See Japanese page) |
| Topics (in English) | |
| Chair | |
| Vice Chair | |
| Secretary | |
| Assistant | |
| Paper Information | |
| Registration To | Component Parts and Materials (CPM) |
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| Language | JPN |
| Title (in Japanese) | (See Japanese page) |
| Sub Title (in Japanese) | (See Japanese page) |
| Title (in English) | Present Status and Target Issue of LSI-Chip Optical Interconnection |
| Sub Title (in English) | |
| Keyword(1) | Optical Interconnection |
| Keyword(2) | Signal Integrity |
| Keyword(3) | Silicon Photonics |
| Keyword(4) | Wavelength-Division-Multiplexing |
| Keyword(5) | 3-D Integration |
| 1st Author's Name | Keishi OHASHI |
| 1st Author's Affiliation | MIRAI-Selete:Green Inovation Res. Labs, NEC Corporation() |
| 2nd Author's Name | Tohru MOGAMI |
| 2nd Author's Affiliation | MIRAI-Selete |
| Date | 2010-11-29 |
| Paper # | CPM2010-129,ICD2010-88 |
| Volume (vol) | vol.110 |
| Number (no) | 314 |
| Page | pp.pp.- |
| #Pages | 6 |
| Date of Issue | |