Presentation 2010-11-29
Problems of on-chip interconnection and optical interconnection
Shin YOKOYAMA, Yoshiteru AMEMIYA,
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Abstract(in English) The problems of current LSI with metal interconnection are pointed out, i.e., increasing signal delay and power dissipation of global metal interconnection. Some of possible solutions, transmission line, standing-wave signal distribution method and optical interconnection are explained. As the candidate of application of optical interconnection, the neural network chip is introduced and our recent research results on the Si ring resonator, which is the key device of the neural net work, is demonstrated.
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Keyword(in English) LSI / Metal interconnect / Transmission line / Standing-wave signal distribution / Optical interconnect / Neural network / Si ring resonator
Paper # CPM2010-128,ICD2010-87
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Conference Information
Committee CPM
Conference Date 2010/11/22(1days)
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Registration To Component Parts and Materials (CPM)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Problems of on-chip interconnection and optical interconnection
Sub Title (in English)
Keyword(1) LSI
Keyword(2) Metal interconnect
Keyword(3) Transmission line
Keyword(4) Standing-wave signal distribution
Keyword(5) Optical interconnect
Keyword(6) Neural network
Keyword(7) Si ring resonator
1st Author's Name Shin YOKOYAMA
1st Author's Affiliation Research Institute for Nanodevice and Bio Systems, Hiroshima University()
2nd Author's Name Yoshiteru AMEMIYA
2nd Author's Affiliation Research Institute for Nanodevice and Bio Systems, Hiroshima University
Date 2010-11-29
Paper # CPM2010-128,ICD2010-87
Volume (vol) vol.110
Number (no) 314
Page pp.pp.-
#Pages 6
Date of Issue