Presentation 2010-11-26
Development and Manufacturing System of Large-Scale Integrated Circuits for Space & commercial Dual Use
Hirobumi SAITO, Kazuyuki HIROSE, Yoshikatsu KURODA, Shigeru ISHII,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) We have developed dual-use LST technologies and manufacturing system both for space and high-temperature / high reliability commercial applications. Radiation-hardening is obtained by means of circuit designs for 0.2μm fully-depleted SOI process.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Large Scale Integrated for Space Application / Common Use for Commercial & Space Application / Dual-Use / High Reliability / Radiation-Hardened Device
Paper # SANE2010-126
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Conference Information
Committee SANE
Conference Date 2010/11/19(1days)
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Paper Information
Registration To Space, Aeronautical and Navigational Electronics (SANE)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Development and Manufacturing System of Large-Scale Integrated Circuits for Space & commercial Dual Use
Sub Title (in English)
Keyword(1) Large Scale Integrated for Space Application
Keyword(2) Common Use for Commercial & Space Application
Keyword(3) Dual-Use
Keyword(4) High Reliability
Keyword(5) Radiation-Hardened Device
1st Author's Name Hirobumi SAITO
1st Author's Affiliation Japan Aerospace Exploration Agency()
2nd Author's Name Kazuyuki HIROSE
2nd Author's Affiliation Japan Aerospace Exploration Agency
3rd Author's Name Yoshikatsu KURODA
3rd Author's Affiliation Mitsubishi Heavy Industries, LTD
4th Author's Name Shigeru ISHII
4th Author's Affiliation Mitsubishi Heavy Industries, LTD
Date 2010-11-26
Paper # SANE2010-126
Volume (vol) vol.110
Number (no) 308
Page pp.pp.-
#Pages 6
Date of Issue