Presentation 2010-11-18
An Approach to Module Placement:Sequence Pair and its Expansion
Mineo KANEKO,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) Placement is the problem to find locations of given set of modules (modeled as rectangles) such that any two modules do not overlap, and it is a crucial phase of LSI design. "Sequence Pair" is the technique to present individual placement solution by a code of finite length, and it defines a finite solution space for handling placement problem in the framework of Combinatorial Optimization. In this talk, the fundamental concept and relevant techniques of Sequence Pair will be explained first, and after that, several different directions of its expansion will be presented. The latter includes (1)novel coding schemes for cuboid-placement in 3-dimensional space, repeated placement, etc.,(2)an application to 3-dimensional task-scheduling for dynamically reconfigurable LSI, and (3)discussions on the convergency of Simulated Annealing search.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Rectangle packing / cuboid packing / repeated placement / Simulated Annealing
Paper # CAS2010-76,CST2010-49
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Conference Information
Committee CAS
Conference Date 2010/11/11(1days)
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Paper Information
Registration To Circuits and Systems (CAS)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) An Approach to Module Placement:Sequence Pair and its Expansion
Sub Title (in English)
Keyword(1) Rectangle packing
Keyword(2) cuboid packing
Keyword(3) repeated placement
Keyword(4) Simulated Annealing
1st Author's Name Mineo KANEKO
1st Author's Affiliation Graduate School of Information Science, Japan Advanced Institute of Science and Technology()
Date 2010-11-18
Paper # CAS2010-76,CST2010-49
Volume (vol) vol.110
Number (no) 283
Page pp.pp.-
#Pages 58
Date of Issue