Presentation 2010-10-22
A Post-Wall Waveguide Matched Load with Thin-Film Resistor
H. UCHIDA, M. NAKAYAMA, A. INOUE, Y. HIRANO,
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Abstract(in English) A matched load with post-wall waveguide (or SIW; Substrate Integrated Waveguide) is presented. It consists of a post-wall waveguide with a dielectric substrate, where a rectangular-shaped thin-film resistor (TFR) is formed on its upper layer. This simple structure does not require a three-dimensional taper-shaped electromagnetic absorber as in a hollow-waveguide matched load. In terms of the shape of the TFR, rectangular shape can reduce the reflection coefficient of the matched load more than a tapered shape, especially near the cut-off frequency of the waveguide. This means that the rectangular-shaped TFR can miniaturize the matched load. Furthermore, an X-band matched load has been fabricated, and a reflection less than -20 dB for about 22 % relative bandwidth has been achieved.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Post-wall waveguide / SIW / matched load / thin-film resistor
Paper # EMCJ2010-62,MW2010-97
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Conference Information
Committee EMCJ
Conference Date 2010/10/14(1days)
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Paper Information
Registration To Electromagnetic Compatibility (EMCJ)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) A Post-Wall Waveguide Matched Load with Thin-Film Resistor
Sub Title (in English)
Keyword(1) Post-wall waveguide
Keyword(2) SIW
Keyword(3) matched load
Keyword(4) thin-film resistor
1st Author's Name H. UCHIDA
1st Author's Affiliation Mitsubishi Electric Corporation, Information Technology R&D Center()
2nd Author's Name M. NAKAYAMA
2nd Author's Affiliation Mitsubishi Electric Corporation, Information Technology R&D Center
3rd Author's Name A. INOUE
3rd Author's Affiliation Mitsubishi Electric Corporation, Information Technology R&D Center
4th Author's Name Y. HIRANO
4th Author's Affiliation Mitsubishi Electric Corporation, Information Technology R&D Center
Date 2010-10-22
Paper # EMCJ2010-62,MW2010-97
Volume (vol) vol.110
Number (no) 236
Page pp.pp.-
#Pages 6
Date of Issue