Presentation 2010-10-21
3D HIE-FDTD Method for the Network Including Lumped Elements and Its Estimation
Masaki UNNO, Hideki ASAI,
PDF Download Page PDF download Page Link
Abstract(in Japanese) (See Japanese page)
Abstract(in English) For signal/power integrity analysis of the high density packages and printed circuit boards, the FDTD (Finite-Difference Time-Domain) method has been widely used. However, since the time step size which is used for the transient analysis in this method is restricted by the CFL condition, the large amount of CPU time can be required. In order to relax the CFL condition, the HIE(Hybrid Implicit-Explicit)-FDTD method has been proposed. In this report, we describe the HIE-FDTD method which is applicable to the network includes the passive elements and the conductive media. Finaly, we simulated the crosstalk effect among the multi-conductor transmission lines, and then the accuracy and effectiveness are validated by the numerical simulation results.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) FDTD method / HIE-FDTD method / CFL condition / signal/power integrity
Paper # EMCJ2010-57,MW2010-92
Date of Issue

Conference Information
Committee EMCJ
Conference Date 2010/10/14(1days)
Place (in Japanese) (See Japanese page)
Place (in English)
Topics (in Japanese) (See Japanese page)
Topics (in English)
Chair
Vice Chair
Secretary
Assistant

Paper Information
Registration To Electromagnetic Compatibility (EMCJ)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) 3D HIE-FDTD Method for the Network Including Lumped Elements and Its Estimation
Sub Title (in English)
Keyword(1) FDTD method
Keyword(2) HIE-FDTD method
Keyword(3) CFL condition
Keyword(4) signal/power integrity
1st Author's Name Masaki UNNO
1st Author's Affiliation Graduate School of Engineering, Dept. of Systems Eng., Shizuoka University()
2nd Author's Name Hideki ASAI
2nd Author's Affiliation Graduate School of Engineering, Dept. of Systems Eng., Shizuoka University:Dept. of Systems Eng., Shizuoka University
Date 2010-10-21
Paper # EMCJ2010-57,MW2010-92
Volume (vol) vol.110
Number (no) 236
Page pp.pp.-
#Pages 6
Date of Issue