Presentation | 2010-10-21 3D HIE-FDTD Method for the Network Including Lumped Elements and Its Estimation Masaki UNNO, Hideki ASAI, |
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Abstract(in Japanese) | (See Japanese page) |
Abstract(in English) | For signal/power integrity analysis of the high density packages and printed circuit boards, the FDTD (Finite-Difference Time-Domain) method has been widely used. However, since the time step size which is used for the transient analysis in this method is restricted by the CFL condition, the large amount of CPU time can be required. In order to relax the CFL condition, the HIE(Hybrid Implicit-Explicit)-FDTD method has been proposed. In this report, we describe the HIE-FDTD method which is applicable to the network includes the passive elements and the conductive media. Finaly, we simulated the crosstalk effect among the multi-conductor transmission lines, and then the accuracy and effectiveness are validated by the numerical simulation results. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | FDTD method / HIE-FDTD method / CFL condition / signal/power integrity |
Paper # | EMCJ2010-57,MW2010-92 |
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Committee | EMCJ |
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Conference Date | 2010/10/14(1days) |
Place (in Japanese) | (See Japanese page) |
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Registration To | Electromagnetic Compatibility (EMCJ) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | 3D HIE-FDTD Method for the Network Including Lumped Elements and Its Estimation |
Sub Title (in English) | |
Keyword(1) | FDTD method |
Keyword(2) | HIE-FDTD method |
Keyword(3) | CFL condition |
Keyword(4) | signal/power integrity |
1st Author's Name | Masaki UNNO |
1st Author's Affiliation | Graduate School of Engineering, Dept. of Systems Eng., Shizuoka University() |
2nd Author's Name | Hideki ASAI |
2nd Author's Affiliation | Graduate School of Engineering, Dept. of Systems Eng., Shizuoka University:Dept. of Systems Eng., Shizuoka University |
Date | 2010-10-21 |
Paper # | EMCJ2010-57,MW2010-92 |
Volume (vol) | vol.110 |
Number (no) | 236 |
Page | pp.pp.- |
#Pages | 6 |
Date of Issue |