Presentation 2010-10-19
Inductance Evaluation of SQUIDs with Flip-Chip Input Coils
Takahiro YAMADA, Masaaki MAEZAWA, Michitaka MARUYAMA, Takehiko OE, Chiharu URANO, Nobu-hisa KANEKO, Mutsuo HIDAKA, Tetsuro SATOH, Shuichi NAGASAWA, Kenji HINODE, Satoshi KOHJIRO,
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Abstract(in Japanese) (See Japanese page)
Abstract(in English) We are developing integrated cryogenic current comparators (ICCCs). To obtain high accuracy, we have to optimize structures of ICCCs by repeating fabrication and testing of various ICCC structures. Moreover, because of integration of a lot of ICCC components such as winding coils, a superconductor shield, pick-up/input coils and a SQUID, a superconductor multilayer process including Josephson junctions is necessary. Due to these two reasons, development of ICCCs takes a long turn-around time. To shorten the turn-around time, we divided those ICCC components into two parts: each part is integrated on a single chip; one consists of a SQUID washer and the other consists of the remaining CCC core including an input coil. They are connected by using a flip-chip bonding technique. By this design scheme, we can concentrate on developing the CCC core, apart from the SQUID which is not necessary to be optimized, leading to a short turn-around time. In this scheme, however, the SQUID and the input coil should be carefully designed to have a sufficiently large coupling. We designed the input-coil and SQUID chips and evaluated the coupling coefficient.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Cryogenic Current Comparator / Integrated Cryogenic Current Comparator / SQUID / Input coil / Coupling coefficient / Flip-chip bonding / Superconductor / Multilayer process
Paper # SCE2010-30
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Conference Information
Committee SCE
Conference Date 2010/10/12(1days)
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Paper Information
Registration To Superconductive Electronics (SCE)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Inductance Evaluation of SQUIDs with Flip-Chip Input Coils
Sub Title (in English)
Keyword(1) Cryogenic Current Comparator
Keyword(2) Integrated Cryogenic Current Comparator
Keyword(3) SQUID
Keyword(4) Input coil
Keyword(5) Coupling coefficient
Keyword(6) Flip-chip bonding
Keyword(7) Superconductor
Keyword(8) Multilayer process
1st Author's Name Takahiro YAMADA
1st Author's Affiliation National Institute of Advanced Industrial Science and Technology(AIST)()
2nd Author's Name Masaaki MAEZAWA
2nd Author's Affiliation National Institute of Advanced Industrial Science and Technology(AIST)
3rd Author's Name Michitaka MARUYAMA
3rd Author's Affiliation National Institute of Advanced Industrial Science and Technology(AIST)
4th Author's Name Takehiko OE
4th Author's Affiliation National Institute of Advanced Industrial Science and Technology(AIST)
5th Author's Name Chiharu URANO
5th Author's Affiliation National Institute of Advanced Industrial Science and Technology(AIST)
6th Author's Name Nobu-hisa KANEKO
6th Author's Affiliation National Institute of Advanced Industrial Science and Technology(AIST)
7th Author's Name Mutsuo HIDAKA
7th Author's Affiliation International Superconductivity Technology Center(ISTEC)
8th Author's Name Tetsuro SATOH
8th Author's Affiliation International Superconductivity Technology Center(ISTEC)
9th Author's Name Shuichi NAGASAWA
9th Author's Affiliation International Superconductivity Technology Center(ISTEC)
10th Author's Name Kenji HINODE
10th Author's Affiliation International Superconductivity Technology Center(ISTEC)
11th Author's Name Satoshi KOHJIRO
11th Author's Affiliation National Institute of Advanced Industrial Science and Technology(AIST)
Date 2010-10-19
Paper # SCE2010-30
Volume (vol) vol.110
Number (no) 235
Page pp.pp.-
#Pages 6
Date of Issue