Presentation | 2010-08-27 Compact 40-Gbit/s Driver IC integrated EML Module Using Broadband FPC Connection Technique Takatoshi YAGISAWA, Tadashi IKEUCHI, |
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Abstract(in English) | The requirement for reducing the size and cost of 40-Gbit/s optical components has been strong. One of the most promising solutions to satisfy these requirements is to adopt connector-less structure in spite of current coaxial connector interface. We developed over-50-GHz broadband flexible printed circuit (FPC) connection techniques between printed circuit board (PCB) and FPC, FPC and the package of the optical device. We fabricated a compact 40-Gbit/s driver IC integrated 1.55-μm electroabsorption monolithically integrated laser diode (EML) module. We obtained clear eye opening of optical output waveform at 40-Gbit/s. These techniques enable further reductions of size and cost of the 40-Gbit/s optical components. |
Keyword(in Japanese) | (See Japanese page) |
Keyword(in English) | 40-Gbit/s / EML / flexible printed circuit board |
Paper # | EMD2010-50,CPM2010-66,OPE2010-75,LQE2010-48 |
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Conference Information | |
Committee | EMD |
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Conference Date | 2010/8/19(1days) |
Place (in Japanese) | (See Japanese page) |
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Registration To | Electromechanical Devices (EMD) |
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Language | JPN |
Title (in Japanese) | (See Japanese page) |
Sub Title (in Japanese) | (See Japanese page) |
Title (in English) | Compact 40-Gbit/s Driver IC integrated EML Module Using Broadband FPC Connection Technique |
Sub Title (in English) | |
Keyword(1) | 40-Gbit/s |
Keyword(2) | EML |
Keyword(3) | flexible printed circuit board |
1st Author's Name | Takatoshi YAGISAWA |
1st Author's Affiliation | FUJITSU LIMITED:Optoelectronic Industry and Technology Development Association() |
2nd Author's Name | Tadashi IKEUCHI |
2nd Author's Affiliation | FUJITSU LIMITED:Optoelectronic Industry and Technology Development Association |
Date | 2010-08-27 |
Paper # | EMD2010-50,CPM2010-66,OPE2010-75,LQE2010-48 |
Volume (vol) | vol.110 |
Number (no) | 178 |
Page | pp.pp.- |
#Pages | 4 |
Date of Issue |