Presentation 2009-12-11
Self-alignment technology of optical devices and optical subassembly for optical interconnect
Atsushi SUZUKI, Katsuya KIKUCHI, Yoshikuni OKADA, Hiroshi NAKAGAWA, Masahiro AOYAGI, Takashi MIKAWA,
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Abstract(in English) We report a novel optical implementation technology and an optical subassembly for inter- and intra-cabinet optical signal transmission. In order to achieve optical coupling between a surface-type optical device and an optical fiber, we have developed a self-alignment technology using surface tension of liquid and transparent adhesive. We have achieved the self-alignment between a photodiode (PD) and a multimode optical fiber (MMF). Optical coupling efficiency of average 72% and high-speed modulation of 10 Gb/s are demonstrated. The optical subassembly is provided to use the self-alignment technology in constituting an optical module for optical interconnections.
Keyword(in Japanese) (See Japanese page)
Keyword(in English) Self-alignment / optical interconnect / inter and intra-cabinet optical signal transmission / surface-type optical device / surface tension / liquid adhesive / alignment / optical subassembly
Paper # LQE2009-153
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Conference Information
Committee LQE
Conference Date 2009/12/4(1days)
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Registration To Lasers and Quantum Electronics (LQE)
Language JPN
Title (in Japanese) (See Japanese page)
Sub Title (in Japanese) (See Japanese page)
Title (in English) Self-alignment technology of optical devices and optical subassembly for optical interconnect
Sub Title (in English)
Keyword(1) Self-alignment
Keyword(2) optical interconnect
Keyword(3) inter and intra-cabinet optical signal transmission
Keyword(4) surface-type optical device
Keyword(5) surface tension
Keyword(6) liquid adhesive
Keyword(7) alignment
Keyword(8) optical subassembly
1st Author's Name Atsushi SUZUKI
1st Author's Affiliation NGK SPARK PLUG CO., LTD., Engineering R & D Group, R & D Center()
2nd Author's Name Katsuya KIKUCHI
2nd Author's Affiliation National Institute of Advanced Industrial Science and technology (AIST), Nanoelectronics Research Institute
3rd Author's Name Yoshikuni OKADA
3rd Author's Affiliation National Institute of Advanced Industrial Science and technology (AIST), Nanoelectronics Research Institute
4th Author's Name Hiroshi NAKAGAWA
4th Author's Affiliation National Institute of Advanced Industrial Science and technology (AIST), Nanoelectronics Research Institute
5th Author's Name Masahiro AOYAGI
5th Author's Affiliation National Institute of Advanced Industrial Science and technology (AIST), Nanoelectronics Research Institute
6th Author's Name Takashi MIKAWA
6th Author's Affiliation National Institute of Advanced Industrial Science and technology (AIST), Nanoelectronics Research Institute
Date 2009-12-11
Paper # LQE2009-153
Volume (vol) vol.109
Number (no) 331
Page pp.pp.-
#Pages 6
Date of Issue